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  1994 data sheet the mark shows major revised points. mos integrated circuit 8-bit single-chip microcontroller m pd78052,78053,78054,78055,78056,78058 description the m pd78052,78053,78054,78055,78056 and 78058 are the m pd78054 subseries products of the 78k/0 series. 8-bit resolution a/d converter, 8-bit resolution d/a converter, timer, serial interface, real-time output port and interrupt functions. the m pd78p054 and 78p058, one-time prom or eprom products which can be operated in the same supply voltage as for the mask rom product, and various development tools are also available. details of the function description, etc, are described in the following users manual. be sure to read it when designing. m pd78054, 78054y subseries users manual: u11747e 78k/0 series users manual instruction: u12326e features ? large on-chip rom & ram items program data memory internal high- internal internal package product name memory (rom) speed ram buffer ram expanded ram m pd78052 16 kbytes 512 bytes 32 bytes no m pd78053 24 kbytes 1024 bytes m pd78054 32 kbytes m pd78055 40 kbytes m PD78056 48 kbytes m pd78058 60 kbytes 1024 bytes ? external memory expansion space: 64k bytes ? minimum instruction execution time can be varied from high-speed (0.4 m s) to ultra-low-speed (122 m s) ? i/o ports: 69 (n-ch open-drain : 4) ? 8-bit resolution a/d converter : 8 channels ? 8-bit resolution d/a converter : 2 channels ? serial interface : 3 channels ? timer: 5 channels ? supply voltage: v dd = 2.0 to 6.0 v applications cellular phone, pager, printer, av equipment, airconditioners, cameras, ppc, fuzzy home appliances, vending machine, etc. document no. u12327ej4v0ds00 (4th edition) date published september 1997 n printed in japan the information in this document is subject to change without notice. ? 80-pin plastic qfp (14 14 mm) ? 80-pin plastic tqfp (fine pitch) (12 12 mm)
2 m pd78052, 78053, 78054, 78055, 78056, 78058 ordering information part number package m pd78052gc- -8bt 80-pin plastic qfp (14 14 mm) m pd78052gk- -be9 80-pin plastic tqfp (fine pitch) (12 12 mm) m pd78053gc- -8bt 80-pin plastic qfp (14 14 mm) m pd78053gk- -be9 80-pin plastic tqfp (fine pitch) (12 12 mm) m pd78054gc- -8bt 80-pin plastic qfp (14 14 mm) m pd78054gk- -be9 80-pin plastic tqfp (fine pitch) (12 12 mm) m pd78055gc- -8bt 80-pin plastic qfp (14 14 mm) m pd78055gk- -be9 80-pin plastic tqfp (fine pitch) (12 12 mm) m PD78056gc- -8bt 80-pin plastic qfp (14 14 mm) m PD78056gk- -be9 80-pin plastic tqfp (fine pitch) (12 12 mm) m pd78058gc- -8bt 80-pin plastic qfp (14 14 mm) m pd78058gk- -be9 80-pin plastic tqfp (fine pitch) (12 12 mm) remark indicates a rom code suffix.
3 m pd78052, 78053, 78054, 78055, 78056, 78058 78k/0 series product development the following shows the 78k/0 series products development. subseries name are shown inside frames. note under planning. control fip tm drive 100-pin lcd drive iebus tm supported 42/44-pin 64-pin 64-pin 64-pin 80-pin 100-pin 80-pin 80-pin 100-pin 100-pin 80-pin 78k/0 series basic subseries for driving fip, display output total: 34 basic subseries for driving lcds, on-chip uart y subseries products are compatible with i 2 c bus. products under development products in mass production 80-pin 100-pin pd78054 m pd78014 m pd780001 m pd78002 m pd78054y m pd78014y m pd78002y m pd78083 m pd780208 m pd78044h m pd78044f m pd78064b m pd78064 m pd78098 m pd78064y m an iebus controller was added to the pd78054 m emi-noise reduced version of the pd78078 m the i/o and fip c/d of the pd78044f were enhanced, display output total: 53 m emi-noise reduced version of the pd78064 m pd78058f m pd78058fy m pd780058y note m pd780058 m pd78070a m pd78070ay m pd78078 m pd78078y m 80-pin pd780308 m pd780308y m the sio of the pd78064 was enhanced and rom, ram capacity increased m 100-pin meter control 80-pin on-chip controller/driver for automobile meter drive pd780973 m lv 64-pin on-chip pwm output, lv digital code decoder, and hsync counter pd78p0914 m pd78075by m pd78075b m 100-pin pd780018ay m 100-pin pd780024y m pd780024 m 64-pin pd780034y m pd780034 m 64-pin 64-pin pd78014h m 64-pin pd78018f m pd78018fy m a timer was added to the pd78054 and external interface was enhanced m rom-less version of the pd78078 m emi-noise reduced version of the pd78054 m uart and d/a converter were added to the pd78014 and i/o was enchanced m a/d converter of the pd780024 was enchanced m serial i/o of the pd78018f was added and emi-noise was reduced m serial i/o of the pd78054 was enhanced and emi-noise was reduced m emi-noise reduced version of pd78018f m serial i/o of the pd78078y was enhanched and the function is limited m low-voltage (1.8 v) operation version of the pd78014, with larger selection of rom and ram capacities m an a/d converter and 16-bit timer were added to the pd78002 m an a/d converter was added to the pd78002 m basic subseries for control on-chip uart, capable of operating at low voltage (1.8 v) pd780924 m 64-pin pd780964 m 64-pin inverter control pd780228 m 100-pin on-chip inverter control circuit and uart. emi-noise was reduced. a/d converter of the pd780924 was enhanced m the i/o and fip c/d of the pd78044h were enhanced, display output total: 48 m n-ch open drain was added to the pd78044f, display output total: 34 m 64-pin pd780988 m inverter control,timer, and sio of the pd780964 were enhanced. rom and ram capacity increased m pd78098b m 80-pin emi-noise reduced version of the pd78064 m
4 m pd78052, 78053, 78054, 78055, 78056, 78058 the following lists the main functional differences between subseries products. function rom timer 8-bit 10-bit 8-bit serial i/o v dd min. external subseries name capacity 8-bit 16-bit watch wdt a/d a/d d/a interface value expansion control m pd78075b 32 k to 40 k 4 ch 1 ch 1 ch 1 ch 8 ch C 2 ch 3 ch (uart : 1 ch) 88 1.8 v m pd78078 48 k to 60 k m pd78070a C 61 2.7 v m pd780058 24 k to 60 k 2 ch 3 ch (time division 68 1.8 v uart: 1 ch) m pd78058f 48 k to 60 k 3 ch (uart: 1 ch) 69 2.7 v m pd78054 16 k to 60 k 2.0 v m pd780034 8 k to 32 k C 8 ch C 3 ch (uart: 1 ch, time 51 1.8 v m pd780024 8 ch C division 3-wire: 1 ch) m pd78014h 2 ch 53 m pd78018f 8 k to 60 k m pd78014 8 k to 32 k 2.7 v m pd780001 8 k C C 1 ch 39 C m pd78002 8 k to 16 k 1 ch C 53 m pd78083 C 8 ch 1 ch (uart: 1 ch) 33 1.8 v C inverter m pd780988 32 k to 60 k 3 ch note 1 C 1 ch C 8 ch C 3 ch (uart: 2 ch) 47 4.0 v control m pd780964 8 k to 32 k note 2 2 ch (uart: 2 ch) 2.7 v m pd780924 8 ch C fip m pd780208 32 k to 60 k 2 ch 1 ch 1 ch 1 ch 8 ch C C 2 ch 74 2.7 v C drive m pd780228 48 k to 60 k 3 ch C C 1 ch 72 4.5 v m pd78044h 32 k to 48 k 2 ch 1 ch 1 ch 68 2.7 v m pd78044f 16 k to 40 k 2 ch lcd m pd780308 48 k to 60 k 2 ch 1 ch 1 ch 1 ch 8 ch C C 3 ch (time division 57 2.0 v C drive uart: 1ch) m pd78064b 32 k 2 ch (uart : 1 ch) m pd78064 16 k to 32 k iebus m pd78098b 40 k to 60 k 2 ch 1 ch 1 ch 1 ch 8 ch C 2 ch 3 ch (uart : 1 ch) 69 2.7 v supported m pd78098 32 k to 60 k meter m pd780973 24 k to 32 k 3 ch 1 ch 1 ch 1 ch 5 ch C C 2 ch (uart : 1 ch) 56 4.5 v C control lv m pd78p0914 32 k 6 ch C C 1 ch 8 ch C C 2 ch 54 4.5 v notes 1. 16-bit timer: 2 channels 10-bit timer: 1 channel 2. 10-bit timer: 1 channel
5 m pd78052, 78053, 78054, 78055, 78056, 78058 overview of function product name item m pd78052 m pd78053 m pd78054 m pd78055 m PD78056 m pd78058 internal rom 16 kbytes 24 kbytes 32 kbytes 40 kbytes 48 kbytes 60 kbytes memory high-speed ram 512 bytes 1024 bytes buffer ram 32 bytes expanded ram none 1024 bytes memory space 64 kbytes general registers 8 bits 32 registers (8 bits 8 registers 4 banks) minimum instruction execution time on-chip minimum instruction execution time cycle modification function when main system clock selected 0.4 m s/0.8 m s/1.6 m s/3.2 m s/6.4 m s/12.8 m s (at 5.0-mhz operation) when subsystem clock selected 122 m s (at 32.768-khz operation) instruction set ? 16-bit operation ? multiplication/division (8 bits 8 bits,16 bits ? 8 bits) ? bit manipulation (set, reset, test, boolean operation) ? bcd correction, etc. i/o ports total : 69 ? cmos input : 0 2 ? cmos i/o : 63 ? n-ch open-drain i/o : 4 a/d converter ? 8-bit resolution 8 channels d/a converter ? 8-bit resolution 2 channels serial interface ? 3-wire serial i/o/sbi/2-wire serial i/o mode selectable: 1 channel ? 3-wire serial i/o mode (on-chip max. 32-byte automatic data transmit/receive function): 1 channel ? 3-wire serial i/o/uart mode selectable : 1 channel timer ? 16-bit timer/event counter : 1 channel ? 8-bit timer/event counter : 2 channels ? watch timer : 1 channel ? watchdog timer : 1 channel timer output 3 (14-bit pwm output 1) clock output 19.5 khz, 39.1 khz, 78.1 khz, 156 khz, 313 khz, 625 khz, 1.25 mhz, 2.5 mhz, 5.0 mhz (at main system clock 5.0-mhz operation) 32.768 khz (at subsystem clock 32.768-khz operation) buzzer output 1.2 khz, 2.4 khz, 4.9 khz, 9.8 khz (at main system clock 5.0-mhz operation) vectored maskable internal interrupt : 13, external interrupt : 7 interrupt non-maskable internal interrupt : 1 sources software 1 test input internal : 1, external : 1 supply voltage v dd = 2.0 to 6.0 v operating ambient temperature t a = C40 to +85 c package ? 80-pin plastic qfp (14 14 mm) ? 80-pin plastic tqfp (fine pitch) (12 12 mm)
6 m pd78052, 78053, 78054, 78055, 78056, 78058 contents 1. pin configuration (top view) .............................................................................................. 7 2. block diagram ............................................................................................................... ........ 9 3. pin functions ................................................................................................................ ........... 10 3.1 port pins ................................................................................................................... ............................ 10 3.2 other pins .................................................................................................................. ........................... 12 3.3 pin i/o circuits and recommended connection of unused pins ................................................... 14 4. memory space ................................................................................................................. ......... 18 5. peripheral hardware function features .................................................................. 20 5.1 ports ....................................................................................................................... ............................... 20 5.2 clock generator ............................................................................................................. ...................... 21 5.3 timer/event counter ......................................................................................................... ................... 21 5.4 clock output control circuit ................................................................................................ .............. 24 5.5 buzzer output control circuit ............................................................................................... ............. 24 5.6 a/d converter ............................................................................................................... ........................ 25 5.7 d/a converter .............................................................................................................. ........................ 26 5.8 serial interfaces ........................................................................................................... ........................ 26 5.9 real-time output port functions ............................................................................................. .......... 28 6. interrupt functions and test functions .................................................................... 29 6.1 interrupt functions ......................................................................................................... ..................... 29 6.2 test functions .............................................................................................................. ........................ 33 7. external device expansion functions ......................................................................... 34 8. standby function ............................................................................................................. ..... 34 9. reset function ............................................................................................................... ........ 34 10. instruction set ............................................................................................................. ......... 35 11. electrical specifications ................................................................................................. 38 12. characteristic curves (reference value) ................................................................. 65 13. package drawings ............................................................................................................ .... 67 14. recommended soldering conditions ............................................................................ 69 appendix a. development tools ............................................................................................. 71 appendix b. related documents ............................................................................................ 73
7 m pd78052, 78053, 78054, 78055, 78056, 78058 1. pin configuration (top view) 80-pin plastic qfp (14 14 mm) m pd78052gc- -8bt, 78053gc- -8bt, 78054gc- -8bt, 78055gc- -8bt, m PD78056gc- -8bt, 78058gc- -8bt 80-pin plastic tqfp (fine pitch) (12 12 mm) m pd78052gk- -be9, 78053gk- -be9, 78054gk- -be9, 78055gk- -be9, m PD78056gk- -be9, 78058gk- -be9 cautions 1. ic (internally connected) pin should be connected directly to v ss . 2. av dd pin should be connected to v dd pin. 3. av ss pin should be connected to v ss pin. p15/ani5 40 p64/rd p127/rtp7 p14/ani4 78 79 80 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 p13/ani3 p12/ani2 p11/ani1 p10/ani0 av ref0 av dd xt1/p07 xt2 ic x1 x2 v dd p06/intp6 p05/intp5 p04/intp4 p03/intp3 p02/intp2 p01/intp1/ti01 p00/intp0/ti00 reset p126/rtp6 p125/rtp5 p124/rtp4 p123/rtp3 p122/rtp2 p121/rtp1 p120/rtp0 p37 p36/buz p35/pcl p34/ti2 p33/ti1 p32/to2 p31/to1 p30/to0 p67/astb p66/wait p65/wr 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 p62 p63 p60 p61 p56/a14 p57/a15 v ss p53/a11 p54/a12 p55/a13 p52/a10 p50/a8 p51/a9 p46/ad6 p47/ad7 p44/ad4 p45/ad5 p42/ad2 p43/ad3 1 p16/ani6 p17/ani7 2 3 av ss 4 p130/ano0 5 p131/ano1 6 av ref1 7 p70/si2/r x d 8 p71/so2/t x d 9 p72/sck2/asck 10 p20/si1 11 p21/so1 12 p22/sck1 13 p23/stb 14 p24/busy 15 p25/si0/sb0 16 p26/so0/sb1 17 p27/sck0 18 19 20 p40/ad0 p41/ad1 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41
8 m pd78052, 78053, 78054, 78056, 78055, 78058 p130, p131 : port13 pcl : programmable clock rd : read strobe reset : reset rtp0 to rtp7 : real-time output port r x d : receive data sb0, sb1 : serial bus sck0 to sck2 : serial clock si0 to si2 : serial input so0 to so2 : serial output stb : strobe ti00, ti01 : timer input ti1, ti2 : timer input to0 to to2 : timer output t x d : transmit data v dd : power supply v ss : ground wait : wait wr : write strobe x1, x2 : crystal (main system clock) xt1, xt2 : crystal (subsystem clock) a8 to a15 : address bus ad0 to ad7 : address/data bus ani0 to ani7 : analog input ano0, ano1 : analog output asck : asynchronous serial clock astb : address strobe av dd : analog power supply av ref0 , av ref1 : analog reference voltage av ss : analog ground busy : busy buz : buzzer clock ic : internally connected intp0 to intp6 : interrupt from peripherals p00 to p07 : port0 p10 to p17 : port1 p20 to p27 : port2 p30 to p37 : port3 p40 to p47 : port4 p50 to p57 : port5 p60 to p67 : port6 p70 to p72 : port7 p120 to p127 : port12
9 m pd78052, 78053, 78054, 78055, 78056, 78058 2. block diagram remark the internal rom and ram capacities differ depending on the product. to0/p30 16-bit timer/ event counter ti00/intp0/p00 ti01/intp1/p01 to1/p31 8-bit timer/ event counter 1 ti1/p33 to2/p32 8-bit timer/ event counter 2 ti2/p34 watchdog timer watch timer si0/sb0/p25 serial interface 0 so0/sb1/p26 sck0/p27 si2/rxd/p70 serial interface 2 so2/txd/p71 sck2/asck/p72 av dd a/d converter av ss av ref0 ani0/p10- ani7/p17 interrupt control intp0/p00- intp6/p06 buzzer output buz/p36 clock output control pcl/p35 p00 port0 p01-p06 p07 port1 p10-p17 port2 p25-p27 port3 p30-p37 port7 p70-p72 p120-p127 p130, p131 real-time output por t rtp0/p120- rtp7/p127 external access ad0/p40- ad7/p47 astb/p67 reset x1 x2 xt1/p07 xt2 78k/0 cpu core rom ram system control v dd v ss ic a8/p50- a15/p57 rd/p64 wr/p65 wait/p66 si1/p20 serial interface 1 so1/p21 sck1/p22 stb/p23 busy/p24 av ss d/a converter av ref1 ano0/p130, ano1/p131 port4 p40-p47 port5 p50-p57 port6 p60-p67 port12 port13
10 m pd78052, 78053, 78054, 78056, 78055, 78058 pin name i/o function after dual- reset function pin p00 input port 0 input only input intp0/ti00 p01 input/ 8-bit i/o port input/output can be specified bit-wise. input intp1/ti01 p02 output when used as an input port, pull-up resistor can be intp2 p03 used by software. intp3 p04 intp4 p05 intp5 p06 intp6 p07 note 1 input input only input xt1 p10 to p17 input/ port 1 input ani0 to ani7 output 8-bit input/output port. input/output can be specified bit-wise. when used as an input port, pull-up resistor can be used by software. note 2 p20 input/ port 2 input si1 p21 output 8-bit input/output port. so1 p22 input/output can be specified bit-wise. sck1 p23 when used as an input port, pull-up resistor can be used by software. stb p24 busy p25 si0/sb0 p26 so0/sb1 p27 sck0 p30 input/ port 3 input to0 p31 output 8-bit input/output port. to1 p32 input/output can be specified bit-wise. to2 p33 when used as an input port, pull-up resistor can be used by software. ti1 p34 ti2 p35 pcl p36 buz p37 p40 to p47 input/ port 4 input ad0 to ad7 output 8-bit input/output port. input/output can be specified in 8-bit unit. when used as an input port, pull-up resistor can be used by software. test input flag (krif) is set to 1 by falling edge detection. 3. pin functions 3.1 port pins (1/2) notes 1. when using the p07/xt1 pins as an input port, set 1 in the bit 6 (frc) of the processor clock control register (pcc). on-chip feedback resistor of the subsystem clock oscillator should not be used. 2. when using the p10/ani0 to p17/ani7 pins as the a/d converter analog input pins, set port 1 to the input mode. use of the pull-up resistor is cancelled automatically.
11 m pd78052, 78053, 78054, 78055, 78056, 78058 pin name i/o function after dual- reset function pin p50 to p57 input/ port 5 input a8 to a15 output 8-bit input/output port. led can be driven directly. input/output can be specified bit-wise. when used as an input port, pull-up resistor can be used by software. p60 input/ port 6 n-ch open-drain input/output port. input p61 output 8-bit input/outport port. on-chip pull-up resistor can be p62 input/output can be specified specified by mask option. p63 bit-wise. led can be driven directly. p64 when used as an input port, input rd p65 pull-up resistor can be used by wr p66 software. wait p67 astb p70 input/ input si2/rxd p71 output so2/txd p72 sck2/asck p120 to p127 input/ port 12 input rtp0 to rtp7 output 8-bit input/output port. input/output can be specified bit-wise. when used as an input port, pull-up resistor can be used by software. p130, p131 input/ port 13 input ano0, ano1 output 2-bit input/output port. input/output can be specified bit-wise. when used as an input port, pull-up resistor can be used by software. 3.1 port pins (2/2) port 7 3-bit input/output port. input/output can be specified bit-wise. when used as an input port, pull-up resistor can be used by software.
12 m pd78052, 78053, 78054, 78056, 78055, 78058 pin name i/o function after dual- reset function pin intp0 input external interrupt request input for which the effective edge (rising input p00/ti00 intp1 edge, falling edge, or both rising edge and falling edge) can be p01/ti01 intp2 specified. p02 intp3 p03 intp4 p04 intp5 p05 intp6 p06 si0 input serial interface serial data input. input p25/sb0 si1 p20 si2 p70/rxd so0 output serial interface serial data output. input p26/sb1 so1 p21 so2 p71/txd sb0 input/ serial interface serial data input/output. input p25/si0 sb1 output p26/so0 sck0 input/ serial interface serial clock input/ output input p27 sck1 output p22 sck2 p72/asck stb output serial interface automatic transmit/receive strobe output. input p23 busy input serial interface automatic transmit/receive busy input. input p24 rxd input asynchronous serial interface serial data input. input p70/si2 txd output asynchronous serial interface serial data output. input p71/so2 asck input asynchronous serial interface serial clock input. input p72/sck2 ti00 input external count clock input to the 16-bit timer (tm0) input p00/intp0 ti01 capture trigger signal input to the capture register (cr00) p01/intp1 ti1 external count clock input to the 8-bit timer (tm1) p33 ti2 external count clock input to the 8-bit timer (tm2) p34 to0 output 16-bit timer (tm0) output (dual-function as 14-bit pwm output) input p30 to1 8-bit timer (tm1) output p31 to2 8-bit timer (tm2) output p32 pcl output clock output (for main system clock, subsystem clock trimming). input p35 buz output buzzer output. input p36 rtp0 to rtp7 output real-time output port by which data is output in synchronization with a trigger. input p120 to p127 ad0 to ad7 input/ low-order address/data bus at external memory expansion. input p40 to p47 output a8 to a15 output high-order address bus at external memory expansion. input p50 to p57 rd output external memory read operation strobe signal output. input p64 wr external memory write operation strobe signal output. p65 3.2 other pins (1/2)
13 m pd78052, 78053, 78054, 78055, 78056, 78058 pin name i/o function after dual- reset function pin wait input wait insertion at external memory access. input p66 astb output strobe output which latches the address information output at port 4 to input p67 access external memory. ani0 to ani7 input a/d converter analog input. input p10 to p17 ano0, ano1 output d/a converter analog output. input p130, p131 av ref0 input a/d converter reference voltage input. av ref1 input d/a converter reference voltage input. av dd a/d converter analog power supply. connected to v dd av ss ground potential of a/d converter and d/a converter. connected to v ss reset input system reset input. x1 input main system clock oscillation crystal connection. x2 xt1 input subsystem clock oscillation crystal connection. input p07 xt2 v dd positive power supply. v ss ground potential. ic internally connected. connect directly to v ss . 3.2 other pins (2/2)
14 m pd78052, 78053, 78054, 78056, 78055, 78058 3.3 pin i/o circuits and recommended connection of unused pins the input/output circuit type of each pin and recommended connection of unused pins are shown in table 3-1. for the input/output circuit configuration of each type, refer to figure 3-1 . table 3-1. input/output circuit type of each pin (1/2) pin name input/output i/o recommended connection when used circuit type p00/intp0/ti00 2 input connect to v ss . p01/intp1/ti01 8-a input/output independently connect to v ss through resistor. p02/intp2 p03/intp3 p04/intp4 p05/intp5 p06/intp6 p07/xt1 16 input connect to v dd . p10/ani0 to p17/ani7 11 input/output independently connect to v dd or v ss through resistor. p20/si1 8-a p21/so1 5-a p22/sck1 8-a p23/stb 5-a p24/busy 8-a p25/si0/sb0 10-a p26/so0/sb1 p27/sck0 p30/to0 5-a p31/to1 p32/to2 p33/ti1 8-a p34/ti2 p35/pcl 5-a p36/buz p37 p40/ad0 to p47/ad7 5-e independently connect to v dd through resistor. p50/a8 to p57/a15 5-a independently connect to v dd or v ss through resistor. p60 to p63 13-b independently connect to v dd through resistor. p64/rd 5-a independently connect to v dd or v ss through resistor. p65/wr p66/wait p67/astb
15 m pd78052, 78053, 78054, 78055, 78056, 78058 pin name input/output i/o recommended connection when used circuit type p70/si2/rxd 8-a input/output independently connect to v dd or v ss through resistor. p71/so2/txd 5-a p72/sck2/asck 8-a p120/rtp0 to p127/rtp7 5-a input/output p130/ano0 , p131/ano1 12-a input/output independently connect to v ss through resistor. reset 2 input xt2 16 leave open. av ref0 connect to v ss . av ref1 connect to v dd . av dd av ss connect to v ss . ic connect to v ss directly. table 3-1. input/output circuit type of each pin (2/2)
16 m pd78052, 78053, 78054, 78056, 78055, 78058 figure 3-1. pin input/output circuits (1/2) type 2 in type 8-a pull-up enable data output disable v p-ch n-ch p-ch in/out dd v dd type 10-a enable type 11 pull-up enable data output disable v p-ch n-ch p-ch in/out dd v dd type 5-a input enable type 5-e pull-up enable data output disable v p-ch n-ch p-ch in/out dd v dd schmitt-triggered input with hysteresis characteristic pull-up enable data output disable in/out n-ch v ref input dd (threshold voltage) v p-ch n-ch p-ch dd v p-ch + - comparator pull-up enable data output disable v p-ch n-ch p-ch in/out dd v dd open drain
17 m pd78052, 78053, 78054, 78055, 78056, 78058 figure 3-1. pin input/output circuits (2/2) type 12-a type 16 pull-up enable data output disable v p-ch n-ch p-ch in/out dd v dd n-ch input enable type 13-b data output disable n-ch p-ch in/out v dd v dd rd mask option middle-high voltage input buffer p-ch analog output voltage xt1 feed back cut-off xt2 p-ch
18 m pd78052, 78053, 78054, 78056, 78055, 78058 4. memory space figure 4-1 shows the m pd78052/78053/78054/78055/78056/78058 memory map. figure 4-1. memory map special function registers (sfr) 256 8 bits general registers 32 8 bits internal high-speed ram note 3 use prohibited internal buffer ram 32 8 bits use prohibited external memory internal rom note 3 data memory space program memory space ffffh ff00h feffh fee0h fedfh mmmmh mmmmh - 1 fae0h fadfh fac0h fabfh fa80h fa7fh nnnnh + 1 nnnnh 0000h use prohibited internal expanded ram 1024 8 bits use prohibited note 2 7a7fh f800h f7ffh f400h f3ffh f000h program area callf entry area program area callt table area vector table area nnnnh 1000h 0fffh 0800h 07ffh 0080h 007fh 0040h 003fh 0000h note 1 notes 1. m pd78058 only 2. when the external device expansion function is used with the m pd78058, set the internal rom capacity to 56 kbytes or less using the memory size switching register (ims). 3. the internal rom capacity and internal high-speed ram capacity depend on the products (see the next table).
19 m pd78052, 78053, 78054, 78055, 78056, 78058 internal rom last address nnnnh relevant product name internal ram first address mmmmh 3fffh m pd78052 m pd78053 m pd78054 5fffh 7fffh fd00h m pd78055 m PD78056 m pd78058 bfffh efffh 9fffh fb00h
20 m pd78052, 78053, 78054, 78055, 78056, 78058 name pin name function port 0 p00, p07 dedicated input port pins p01 to p06 input/output port pins. input/output specifiable bit-wise. when used as input port pins, on-chip pull-up resistor can be used by software. port 1 p10 to p17 input/output port pins. input/output specifiable bit-wise. when used as input port pins, on-chip pull-up resistor can be used by software. port 2 p20 to p27 input/output port pins. input/output specifiable bit-wise. when used as input port pins, on-chip pull-up resistor can be used by software. port 3 p30 to p37 input/output port pins. input/output specifiable bit-wise. when used as input port pins, on-chip pull-up resistor can be used by software. port 4 p40 to p47 input/output port pins. input/output specifiable in 8-bit units. when used as input port pins, on-chip pull-up resistor can be used by software. test flag (krif) is set to 1 by falling edge detection. port 5 p50 to p57 input/output port pins. input/output specifiable bit-wise. when used as input port pins, on-chip pull-up resistor can be used by software. led direct drive capability. port 6 p60 to p63 n-channel open-drain input/output port pins. input/output specifiable bit-wise. on-chip pull-up resistor can be used by mask option. led direct drive capability. p64 to p67 input/output port pins. input/output specifiable bit-wise. when used as input port pins, on-chip pull-up resistor can be used by software. port 7 p70 to p72 input/output port pins. input/output specifiable bit-wise. when used as input port pins, on-chip pull-up resistor can be used by software. port 12 p120 to p127 input/output port pins. input/output specifiable bit-wise. when used as input port pins, on-chip pull-up resistor can be used by software. port 13 p130, p131 input/output port pins. input/output specifiable bit-wise. when used as input port pins, on-chip pull-up resistor can be used by software. 5. peripheral hardware function features 5.1 ports the following 3 types of i/o ports are available. ? cmos input (p00, p07) : 2 ? cmos input/output (p01 to p06, port 1 to port 5, p64 to p67, port 7, port 12, port 13) : 63 ? n-channel open-drain input/output (p60 to p63) : 4 total : 69 table 5-1. port functions
21 m pd78052, 78053, 78054, 78055, 78056, 78058 5.2 clock generator two types of generators, a main system clock generator and a subsystem clock generator, are avaibable. the minimum instruction execution time can also be changed. ? 0.4 m s/0.8 m s/1.6 m s/3.2 m s/6.4 m s/12.8 m s (main system clock: at 5.0-mhz operation) ? 122 m s (subsystem clock: at 32.768-khz operation) figure 5-1. clock generator block diagram 5.3 timer/event counter the m pd78052/78053/78054/78055/78056/78058 incorporate 5 channels of the timer/event counter. ? 16-bit timer/event counter : 1 channel ? 8-bit timer/event counter : 2 channels ? watch timer : 1 channel ? watchdog timer : 1 channel table 5-2. operation of timer/event counter 16-bit timer/event counter 8-bit timer/event counter watch timer watchdog timer operation mode interval timer 1 channel 2 channels 1 channel 1 channel external event counter 1 channel 2 channels function timer output 1 output 2 outputs pwm output 1 output pulse amplitude measurement 2 inputs square wave output 1 output 2 outputs ono-shot pulse output 1 output interrupt source 2 2 1 1 test input 1 input xt1/p07 xt2 x1 x2 f xt f xx subsystem clock oscillator watch timer, clock output function prescaler main system clock oscillator clock to peripheral hardware cpu clock (f cpu ) standby control circuit wait control circuit to intp0 sampling clock 2 f xx 2 2 f xx 2 3 f xx 2 4 f xx f xt 2 prescaler selector selector f x f x 2 stop scaler 2 1
22 m pd78052, 78053, 78054, 78055, 78056, 78058 figure 5-2. 16-bit timer/event counter block diagram internal bus selector selector 16-bit timer register (tm0) clear output control circuit pwm pulse output control circuit 16-bit capture/ compare register internal bus intp1 inttm00 to0/p30 inttm01 intp0 ti01/p01/intp1 watch timer output 2f xx f xx f xx /2 2 f xx /2 ti00/p00/intp0 16-bit capture/ compare register (cr01) (cr00) edge detector match match selector figure 5-3. 8-bit timer/event counter block diagram internal bus 8-bit compare register (cr10) 8-bit timer register 1 (tm1) clear match selector output control circuit output control circuit inttm1 to2/p32 inttm2 to1/p31 clear match selector selector selector selector 8-bit compare register (cr20) 8-bit timer register 2 (tm2) internal bus f xx /2 to f xx /2 f x /2 9 11 ti1/p33 f xx /2 to f xx /2 f x /2 9 11 ti2/p34
23 m pd78052, 78053, 78054, 78055, 78056, 78058 figure 5-4. watch timer block diagram figure 5-5. watchdog timer block diagram inttm3 intwt 5-bit counter prescaler selector selector selector selector f xx /2 f w f w f xt 7 2 f w 2 f w 2 f w 2 f w 2 f w 2 f w 2 f w 2 4 5 6 7 8 9 14 13 to 16-bit timer/ event counter control circuit 8-bit counter prescaler intwdt non-maskable interrupt request intwdt maskable interrupt request reset selector 4 5 6 7 8 9 11 2 3 f xx 2 f xx 2 f xx 2 f xx 2 f xx 2 f xx 2 f xx 2 f xx
24 m pd78052, 78053, 78054, 78055, 78056, 78058 5.4 clock output control circuit the clock with the following frequency can be output as a clock output. ? 19.5 khz/39.1 khz/78.1 khz/156 khz/313 khz/625 khz/1.25 mhz/2.5 mhz/5.0 mhz (main system clock: at 5.0-mhz operation) ? 32.768 khz (subsystem clock: at 32.768-khz operation) figure 5-6. clock output control circuit configuration 5.5 buzzer output control circuit the clock with the following frequency can be output as a buzzer output. ? 1.2 khz/2.4 khz/4.9 khz/9.8 khz (main system clock: at 5.0-mhz operation) figure 5-7. buzzer output control circuit block diagram selector synchronization circuit output control circuit pcl/p35 2 3 4 5 6 7 f xx /2 f xx /2 f xx /2 f xx /2 f xx /2 f xx /2 f xx /2 f xx f xt selector output control circuit buz/p36 9 10 11 f xx /2 f xx /2 f xx /2
25 m pd78052, 78053, 78054, 78055, 78056, 78058 5.6 a/d converter an a/d converter of 8-bit resolution 8 channels is incorporated. the following two types of the a/d conversion operation start-up methods are available. ? hardware start ? software start figure 5-8. a/d converter block diagram tap selector intad av dd intp3 internal bus av ref0 av ss a/d conversion result register (adcr) control circuit succesive approxmation register (sar) edge detector ani0/p10 ani1/p11 ani2/p12 ani3/p13 ani4/p14 ani5/p15 ani6/p16 ani7/p17 intp3/p03 selector sample & hold circuit voltage comparator series resistor string
26 m pd78052, 78053, 78054, 78055, 78056, 78058 n = 0, 1 m = 4, 5 x = 1, 2 5.8 serial interfaces 3 channels of the clocked serial interface are incorporated. ? serifal interface channel 0 ? serifal interface channel 1 ? serifal interface channel 2 table 5-3. types and functions of serial interface 5.7 d/a converter a d/a converter of 8-bit resolution 2 channels is available. conversion method is r-2r resistor ladder method. figure 5-9. d/a converter block diagram function serial interface channel 0 serial interface channel 1 serial interface channel 2 3-wire serial i/o made (msb/lsb first switchable) (msb/lsb first switchable) (msb/lsb first switchable) 3-wire serial i/o mode with auto- (msb/lsb first switchable) matic transmit/receive function sbi (serial bus interface) mode (msb first) 2-wire serial i/o mode (msb first) 3-wire serial i/o mode with auto- (dedicated baud rate matic transmit/receive function generator incorporated) internal bus selector d/a conversion value set register n (dacsn) av ref1 av ss damm inttm x dacsn write anon d/a converter mode register
27 m pd78052, 78053, 78054, 78055, 78056, 78058 figure 5-10. serial interface channel 0 block diagram figure 5-11. serial interface channel 1 block diagram busy/acknowledge output circuit output latch serial i/o shift register 0 (sio0) internal bus interrupt request signal generator serial clock counter bus release/command/ acknowledge detector serial clock control circuit selector selector selector si0/sb0/p25 so0/sb1/p26 sck0/p27 intcsi0 to2 f xx /2 to f xx /2 8 internal bus interrupt request signal generator handshake control circuit buffer ram serial clock control circuit selector serial counter serial i/o shift register 1 (sio1) automatic data transmit/ receive address pointer (adtp) automatic data transmit/receive interval specification register (adti) 5-bit counter intcsi1 f xx /2 to f xx /2 to2 8 si1/p20 so1/p21 stb/p23 busy/p24 sck1/p22 match
28 m pd78052, 78053, 78054, 78055, 78056, 78058 figure 5-12. serial interface channel 2 block diagram 5.9 real-time output port functions data set previously in the real-time output buffer register is transferred to the output latch by hardware concurrently with timer interrupt and external interrupt generation in order to output to off-chip. this is real-time output function. and pins to output to off-chip are called real-time output ports. by using a real-time output port, a signal which has no jitter can be output. this is most applicable to control of stepping motor, etc. figure 5-13. real-time output port block diagram internal bus p127 p120 output latch real-time output buffer register higher 4 bits (rtbh) real-time output buffer register higher 4 bits (rtbl) real-time output port mode register (rtpm) output trigger control circuit intp2 inttm1 inttm2 rxd/si2/p70 txd/so2/p71 asck/sck2/p72 intser intsr/intcsi2 intst f xx to f xx /2 10 internal bus receive buffer register (rxb/sio2) direction control circuit receive shift register (rxs) receive control circuit direction control circuit transmit shift register (txs/sio2) transmit control circuit sck output control circuit baud rate generator
29 m pd78052, 78053, 78054, 78055, 78056, 78058 6. interrupt functions and test functions 6.1 interrupt functions there are interrupt functions, 22 sources of three different kinds, as shown below. ? non-maskable : 1 ? maskable : 20 ? software : 1 the following table shows the interrupt source list. table 6-1. interrupt source list (1/2) default note 1 interrupt source internal/ vector basic interrupt type table configuration priority name trigger external address type note 2 non-maskable intwdt watchdog timer overflow internal 0004h (a) (watchdog timer mode 1 selected) maskable 0 intwdt watchdog timer overflow (b) (interval timer mode selected) 1 intp0 pin input edge detection external 0006h (c) 2 intp1 0008h (d) 3 intp2 000ah 4 intp3 000ch 5 intp4 000eh 6 intp5 0010h 7 intp6 0012h 8 intcsi0 end of serial interface channel 0 transfer internal 0014h (b) 9 intcsi1 end of serial interface channel 1 transfer 0016h 10 intser generation of serial interface channel 2 0018h uart receive error 11 intsr end of serial interface channel 2 uart 001ah reception intcsi2 end of serial interface channel 2 3-wire transfer 12 intst end of serial interface channel 2 uart 001ch transmission notes 1. the default priority is a priority order when two or more maskable interrupt requests are generated simultaneously. 0 is the highest order and 18, the lowest. 2. basic configuration types (a) to (e) correspond to a to e in figure 6-1, respectively.
30 m pd78052, 78053, 78054, 78055, 78056, 78058 table 6-1. interrupt source list (2/2) default note 1 interrupt source internal/ vector basic interrupt type table configuration priority name trigger external address type note 2 maskable 13 inttm3 reference time interval signal from internal 001eh (b) watch timer 14 inttm00 generation of match signal of 16-bit 0020h timer register and capture/compare register (cr00) 15 inttm01 generation of match signal of 16-bit 0022h timer register and capture/compare register (cr01) 16 inttm1 generation of match signal of 8-bit 0024h timer/event counter 1 17 inttm2 generation of match signal of 8-bit 0026h timer/event counter 2 18 intad end of conversion by a/d converter 0028h software brk brk instruction execution 003eh (e) notes 1. the default priority is a priority order when two or more maskable interrupts are generated simultaneously. 0 is the highest order and 18, the lowest. 2. basic configuration types (a) to (e) correspond to (a) to (e) in figure 6-1, respectively.
31 m pd78052, 78053, 78054, 78055, 78056, 78058 figure 6-1. interrupt function basic configuration(1/2) (a) internal non-maskable interrupt (b) internal maskable interrupt (c) external maskable interrupt (intp0) internal bus priority control circuit vector table address generator standby release si g nal interrupt request mk internal bus ie pr isp if priority control circuit vector table address generator standby release signal interrupt request mk ie pr isp if priority control circuit vector table address generator sampling clock select register (scs) external interrupt mode register (intm0) edge detector sampling clock internal bus standby release signal interrupt request
32 m pd78052, 78053, 78054, 78055, 78056, 78058 figure 6-1. interrupt function basic configuration(2/2) (d) external maskable interrupt (except intp0) (e) software interrupt if : interrupt request flag ie : interrupt enable flag isp : in-service priority flag mk : interrupt mask flag pr : priority specification flag mk ie pr isp if priority control circuit vector table address generator external interrupt mode register (intm0, intm1) edge detector internal bus standby release signal interrupt request priority control circuit vector table address generator internal bus interrupt request
33 m pd78052, 78053, 78054, 78055, 78056, 78058 6.2 test functions there are two test functions as shown in table 6-2. table 6-2. test input source list test input source internal/external name trigger intwt watch timer overflow internal intpt4 port 4 falling edge detection external figure 6-2. test function basic configuration mk internal bus if standby release signal interrupt request if : test input flag mk : test mask flag
34 m pd78052, 78053, 78054, 78055, 78056, 78058 7. external device expansion functions the external device expansion functions connect external devices to areas other than the internal rom, ram and sfr. ports 4 to 6 are used for external device connection. 8. standby function there are the following two standby functions to reduce the system power consumption. ? halt mode : the cpu operating clock is stopped. the average consumption current can be reduced by intermittent operation in combination with the normal operating mode. ? stop mode : the main system clock oscillation is stopped. the whole operation by the main system clock is stopped, so that the system operates withultra-low power consumption using only the subsystem clock. figure 8-1. stand-by function main system clock operation stop mode (main system clock oscillation stopped) halt mode (clock supply to cpu is stopped, oscillation) subsystem clock operation note halt mode note (clock supply to cpu is stopped, oscillation) interrupt request interrupt request interrupt request halt instruction halt instruction stop instruction css=1 css=0 note the power consumption can be reduced by stopping the main system clock. when the cpu is operating on the subsystem clock, set the bit 7 (mcc) of the processor clock control register (pcc) to stop the main system clock. the stop instruction cannot be used. caution when the main system clock is stopped and the system is operated by the subsystem clock, the subsystem clock should be switched again to the main system clock after the oscillation stabilization time is secured in software. 9. reset function there are the following two reset methods. ? external reset input by reset pin ? internal reset by watchdog timer hung-up time detection
35 m pd78052, 78053, 78054, 78055, 78056, 78058 10. instruction set (1) 8-bit instruction mov, xch, add addc, sub, subc, and, or, xor, cmp, mulu, divuw, inc, dec, ror, rol, rorc, rolc, ror4, rol4, push, pop, dbnz note except r = a second operand first operand #byte a r note sfr saddr !addr16 psw [de] [hl] [hl + byte] [hl + b] [hl + c] $addr16 1 none a r add addc sub subc and or xor cmp mov mov mov mov mov mov mov mov ror xch xch xch xch xch xch xch rol add add add add add rorc addc addc addc addc addc rolc sub sub sub sub sub subc subc subc subc subc and and and and and or or or or or xor xor xor xor xor cmp cmp cmp cmp cmp mov mov add addc sub subc and or xor cmp inc dec b, c sfr mov mov dbnz mov add addc sub subc and or xor cmp saddr mov dbnz inc dec !addr16 mov psw mov mov push pop [de] ror4 mov [hl] mov rol4 [hl + byte] [hl + b] [hl + c] mov x c mulu divuw
36 m pd78052, 78053, 78054, 78055, 78056, 78058 (2) 16-bit instruction mov, xchw, addw, subw, cmpw, push, pop, incw, decw second instruction first instruction ax rp sfrp saddrp !addr16 sp #word addw subw cmpw movw movw movw movw ax movw note movw movw movw movw movw rp note xchw sfrp movw saddrp movw !addr16 movw sp movw none incw, decw push, pop note only when rp = bc, de or hl (3) bit manipulation instruction mov1, and1, or1, xor1, set1, clr1, not1, bt, bf, btclr second instruction first instruction a.bit sfr.bit saddr.bit psw.bit [hl].bit cy $addr16 none a.bit sfr.bit saddr.bit psw.bit [hl].bit cy mov1 mov1 mov1 mov1 mov1 bt bf btclr bt bf btclr bt bf btclr bt bf btclr bt bf btclr set1 clr1 set1 clr1 set1 clr1 set1 clr1 set1 clr1 set1 clr1 not1 mov1 and1 or1 xor1 mov1 and1 or1 xor1 mov1 and1 or1 xor1 mov1 and1 or1 xor1 mov1 and1 or1 xor1 (4) call instruction/branch instruction call, callf, callt, br, bc, bnc, bz, bnz, bt, bf, btclr, dbnz second instruction first instruction ax !addr16 !addr11 [addr5] $addr16 basic instruction compound instruction br call br callf callt br, bc, bnc bz, bnz bt, bf btclr dbnz
37 m pd78052, 78053, 78054, 78055, 78056, 78058 (5) other instructions adjba, adjbs, brk, ret, reti, retb, sel, nop, ei, di, halt, stop
38 m pd78052, 78053, 78054, 78055, 78056, 78058 parameter symbol test conditions rating unit supply voltage v dd C0.3 to +7.0 v av dd C0.3 to v dd + 0.3 v av ref0 C0.3 to v dd + 0.3 v av ref1 C0.3 to v dd + 0.3 v av ss C0.3 to +0.3 v input voltage v i1 p00 to p07, p10 to p17,p20 to p27, p30 top37, C0.3 to v dd + 0.3 v p40 to p47,p50 to p57, p64 to p67, p70 to p72, p120 to p127, p130, p131, x1, x2, xt2, reset v i2 p60 to p63 n-ch open-drain C0.3 to +16 v output voltage v o C0.3 to v dd + 0.3 v analog input voltage v an p10 to p17 analog input pin av ss C 0.3 to av ref0 + 0.3 v output i oh 1 pin C10 ma current high p01 to p06, p30 to p37, p56, p57, p60 to p67, C15 ma p120 to p127 total p10 to p17, p20 to p27, p40 to p47, p50 to p55, C15 ma p70 to p72, p130, p131 total output i ol note 2 1 pin peak value 30 ma current low r.m.s. value 15 ma p50 to p55 total peak value 100 ma r.m.s. value 70 ma p56, p57, p60 to p63 total peak value 100 ma r.m.s. value 70 ma p10 to p17, p20 to p27, p40 to p47, peak value 50 ma p70 to p72, p130, p131 total r.m.s. value 20 ma p01 to p06, p30 to p37, p64 to p67, peak value 50 ma p120 to p127 total r.m.s. value 20 ma operating ambient t a C40 to +85 c temperature storage t stg C65 to +150 c temperature 11. electrical specifications absolute maximum ratings (t a = 25 c) note r.m.s value should be calculated as follows: [r.m.s value] = [peak value] ? duty caution product quality may suffer if the absolute maximum rating is exceeded for even a single parameter or even momentarily. that is, the absolute maximuam ratings are rated values at which the product is on the verge of suffering physical damage, and therefore the product must be used under conditions which ensure that the absolute maximum ratings are not exceeded.
39 m pd78052, 78053, 78054, 78055, 78056, 78058 main system clock oscillation circuit characteristics (t a = e40 to +85 c, v dd = 2.0 to 6.0 v) recommended circuit typ. max. 5.0 4 5.0 10 30 5.0 500 unit mhz ms mhz ms mhz ns resonator ceramic resonator crystal resonator external clock parameter oscillator frequency (fx) note 1 oscillation stabilization time note 2 oscillator frequency (fx) note 1 oscillation stabilization time note 2 x1 input frequency (fx) note 1 x1 input high/low level width (t xh , t xl ) notes 1. indicates only oscillation circuit characteristics. refer to ac characteristics for instruction execution time. 2. time required to stabilize oscillation after reset or stop mode release. cautions 1. when using the main system clock oscillator, wirinin the area enclosed with the broken line should be carried out as follows to avoid an adverse effect from wiring capacitance. ? wiring should be as short as possible. ? wiring should not cross other signal lines. ? wiring should not be placed close to a varying high current. ? the potential of the oscillator capacitor ground should be the same as v ss . ? do not ground wiring to a ground pattern in which a high current flows. ? do not fetch a signal from the oscillator. 2. when the main system clock is stopped and the system is operated by the subsystem clock, the subsystem clock should be switched again to the main system clock after the oscillation stabilization time is secured in software. min. 1.0 1.0 1.0 85 test conditions v dd = oscillator voltage range after v dd reaches oscil- lator voltage range min. v dd = 4.5 to 6.0 v x1 x2 c2 c1 v ss r1 x1 x2 c2 c1 v ss x1 x2 pd74hcu04 m
40 m pd78052, 78053, 78054, 78055, 78056, 78058 subsystem clock oscillation circuit characteristics (t a = e40 to +85 c, v dd = 2.0 to 6.0 v) min. 32 32 5 notes 1. indicates only oscillation circuit characteristics. refer to ac characteristics for instruction execution time. 2. time required to stabilize oscillation after v dd reaches min in the oscillator voltage range. resonator crystal resonator external clock parameter oscillator frequency (f xt ) note 1 oscillation stabilization time note 2 xt1 input frequency (f xt ) note 1 xt1 input high/low level width (t xth , t xtl ) test conditions v dd = 4.5 to 6.0 v typ. 32.768 1.2 max. 35 2 10 100 15 unit khz s khz m s cautions 1. when using the subsystem clock oscillator, wiring in the area enclosed with the broken line should be carried out as follows to avoid an adverse effect from wiring capacitance. ? wiring should be as short as possible. ? wiring should not cross other signal lines. ? wiring should not be placed close to a varying high current. ? the potential of the oscillator capacitor ground should be the same as v ss . ? do not ground wiring to a ground pattern in which a high current flows. ? do not fetch a signal from the oscillator. 2. the subsystem clock oscillation circuit is a circuit with a low amplification level,more prone to misoperation due to noise than the main system clock. recommended circuit xt1 xt2 c4 c3 r2 v ss xt1 xt2
41 m pd78052, 78053, 78054, 78055, 78056, 78058 frequency recommended oscillator manufacturer product name circuit consonant voltage range remarks (mhz) c1 (pf) c2 (pf) min. (v) max. (v) murata mfg. csa5.00mg 5.00 30 30 2.0 6.0 co., ltd. cst5.00mgw 5.00 on chip on chip 2.0 6.0 capacitor on chip kyocera kbr-5.0msa 5.00 33 33 2.0 6.0 lead type corp. kbr-5.0mks 5.00 on chip on chip 2.0 6.0 capacitor on chip, lead type kbr-5.0mws 5.00 on chip on chip 2.0 6.0 capacitor on chip, lead type pbrc 5.00a 5.00 33 33 2.0 6.0 chip type tdk corp. ccr4.0mc3 4.00 on chip on chip 2.0 6.0 capacitor on chip ccr5.0mc3 5.00 on chip on chip 2.0 6.0 capacitor on chip recommended oscillation circuit constant (1) m pd78052, 78053, 78054, 78055, 78056 main system clock: ceramic resonator (t a = e40 to +85 c) main system clock: crystal resonator (t a = e10 to +70 c) c1 (pf) c2 (pf) r1 (k w ) min. (v) max. (v) daishinku corp. smd-49 3.579545 27 27 1.5 2.0 6.0 recommended circuit constant oscillator voltage range product name subsystem clock: crystal resonator (t a = C10 to +70 c) c3 (pf) c4 (pf) r2 (k w ) min. (v) max. (v) daishinku corp. dt-38 32.768 27 20 330 2.0 6.0 (1ta252e00) recommended circuit constant oscillator voltage range product name frequency (mhz) frequency (mhz) manufacturer manufacturer caution the oscillation circuit constants and oscillation voltage range indicate conditions for stable oscillation. however, they do not guarantee accuracy of the oscillation frequency. if the application circuit requires accuracy of the oscillation frequency, it is necessary to set the oscillation frequency in the application circuit. for this, it is necessary to directly contact the manufacturer of the resonator being used.
42 m pd78052, 78053, 78054, 78055, 78056, 78058 frequency recommended oscillator manufacturer product name circuit consonant voltage range remarks (mhz) c1 (pf) c2 (pf) min. (v) max. (v) kyocera pbrc4.19a 4.19 33 33 2.0 6.0 corp. pbrc4.19b 4.19 on chip on chip 2.0 6.0 capacitor on chip kbr-4.19msa 4.19 33 33 2.0 6.0 kbr-4.19mks 4.19 on chip on chip 2.0 6.0 capacitor on chip pbrc4.91a 4.91 33 33 2.0 6.0 pbrc4.91b 4.91 on chip on chip 2.0 6.0 capacitor on chip kbr-4.91msa 4.91 33 33 2.0 6.0 kbr-4.91mks 4.91 on chip on chip 2.0 6.0 capacitor on chip (2) m pd78058 main system clock: ceramic resonator (t a = e40 to +85 c) capacitance (t a = 25 c, v dd = v ss = 0 v) parameter symbol test conditions min. typ. max. unit input c in f = 1 mhz 15 pf capacitance measured pins retured to 0 v. input/output c io f = 1 mhz p01 to p06, p10 to p17, 15 pf capacitance measured pins retured p20 to p27, p30 to p37, to 0 v. p40 to p47, p50 to p57, p64 to p67, p70 to p72, p120 to p127, p130, p131 p60 to p63 20 pf remark the characteristics of the dual-function pins are the same as those of the port pins unless otherwise specified. note for use as p07, use an inverter to input the reverse phase of p07 to the xt2 pin. caution the oscillation circuit constants and oscillation voltage range indicate conditions for stable oscillation. however, they do not guarantee accuracy of the oscillation frequency. if the application circuit requires accuracy of the oscillation frequency, it is necessary to set the oscillation frequency in the application circuit. for this, it is necessary to directly contact the manufacturer of the resonator being used.
43 m pd78052, 78053, 78054, 78055, 78056, 78058 dc characteristics (t a = e40 to +85 c, v dd = 2.0 to 6.0 v) parameter symbol test conditions min. typ. max unit input voltage, v ih1 p10 to p17, p21, p23, p30 to p32, v dd = 2.7 to 6.0 v 0.7 v dd v dd v high p35 to p37, p40 to p47, p50 to p57, p64 to p67, p71, p120 to p127, 0.8 v dd v dd v p130, p131 v ih2 p00 to p06, p20, p22, p24 to p27, v dd = 2.7 to 6.0 v 0.8 v dd v dd v p33, p34, p70, p72, reset 0.85 v dd v dd v v ih3 p60 to p63 v dd = 2.7 to 6.0 v 0.7 v dd 15 v (n-ch open-drain) 0.8 v dd 15 v v ih4 x1, x2 v dd = 2.7 to 6.0 v v dd C 0.5 v dd v v dd C 0.2 v dd v v ih5 xt1/p07, xt2 4.5 v v dd 6.0 v 0.8 v dd v dd v 2.7 v v dd < 4.5 v 0.9 v dd v dd v 2.0 v v dd < 2.7 v note 0.9 v dd v dd v input voltage, v il1 p10 to p17, p21, p23, p30 to p32, v dd = 2.7 to 6.0 v 0 0.3 v dd v low p35 to p37, p40 to p47, p50 to p57, p64 to p67, p71, p120 to p127, 0 0.2 v dd v p130, p131 v il2 p00 to p06, p20, p22, p24 to p27, v dd = 2.7 to 6.0 v 0 0.2 v dd v p33, p34, p70, p72, reset 0 0.15 v dd v v il3 p60 to p63 4.5 v v dd 6.0 v 0 0.3 v dd v 2.7 v v dd < 4.5 v 0 0.2 v dd v 0 0.1 v dd v v il4 x1, x2 v dd = 2.7 to 6.0 v 0 0.4 v 0 0.2 v v il5 xt1/p07, xt2 4.5 v v dd 6.0 v 0 0.2 v dd v 2.7 v v dd < 4.5 v 0 0.1 v dd v 2.0 v v dd < 2.7 v note 0 0.1 v dd v output voltage, v oh v dd = 4.5 to 6.0 v, i oh = C1ma v dd C 1.0 v high i oh = C100 m av dd C 0.5 v output voltage, v ol1 p50 to p57, p60 to p63 v dd = 4.5 to 6.0 v, 0.4 2.0 v low i ol = 15 ma p01 to p06, p10 to p17, p20 to p27, v dd = 4.5 to 6.0 v, 0.4 v p30 to p37, p40 to p47, p64 to p67, i ol = 1.6 ma p70 to p72, p120 to p127, p130, p131 v ol2 sb0, sb1, sck0 v dd = 4.5 to 6.0 v, 0.2 v dd v open-drain, pulled-up (r = 1 k w ) v ol3 i ol = 400 m a 0.5 v note for using the p07/x1 pins as p07, input the reverse phase of p07 to the xt2 pin. remark the characteristics of a dual-function pin and a port pin are the same unless specified otherwise.
44 m pd78052, 78053, 78054, 78055, 78056, 78058 parameter symbol test conditions min. typ. max unit input leakage i lih1 v in = v dd p00 to p06, p10 to p17, p20 to p27, 3 m a current, high p30 to p37, p40 to p47, p50 to p57, p60 to p67, p70 to p72, p120 to p127, p130, p131, reset i lih2 x1, x2, xt1/p07, xt2 20 m a i lih3 v in = 15 v p60 to p63 80 m a input leakage i lil1 v in = 0 v p00 to p06, p10 to p17, p20 to p27, C3 m a current, low p30 to p37, p40 to p47, p50 to p57, p64 to p67, p70 to p72, p120 to p127, p130, p131, reset i lil2 x1, x2, xt1/p07, xt2 C20 m a i lil3 p60 to p63 C3 note 1 m a output leakage i loh v out = v dd 3 m a current, high output leakage i lol v out = 0 v C3 m a current, low mask option pull- r 1 v in = 0 v, p60 to p63 20 40 90 k w up resistor software pull- r 2 v in = 0 v, p01 to p06, 4.5 v v dd 6.0 v 15 40 90 k w up resistor note 2 p10 to p17, p20 to p27, p30 to p37, p40 to p47, p50 to p57, p64 to p67, 2.7 v v dd < 4.5 v 20 500 k w p70 to p72, p120 to p127, p130, p131 dc characteristics (t a = C40 to +85 c, v dd = 2.7 to 6.0 v) notes 1. for p60 to p63 without on-chip pull-up resistor (specifiable by mask option), a low-level input leakage current of C200 m a (max.) flows only during the 1.5 clocks (no wait) after an instruction has been executed to read out port 6 (p6) or port mode register 6 (pm6). outside the period of 1.5 clocks following executing a read-out instruction, the current is C3 m a (max.). 2. a software pull-up resistor can be used only in the range of v dd = 2.7 to 6.0 v. remark the characteristics of a dual-function pin and a port pin are the same unless specified otherwise.
45 m pd78052, 78053, 78054, 78055, 78056, 78058 dc characteristics (t a = e40 to +85 c, v dd = 2.0 to 6.0 v) notes 1. operating in high-speed mode (when set the processor clock control register (pcc) to 00h). 2. operating in low-speed mode (when set the pcc to 04h). 3. operation with the main system clock f xx = f x /2 (when oscillation mode selection register (osms) is set to 00h) 4. operation with the main system clock f xx = f x (when osms is set to 01h) 5. this current flows in the v dd and av dd pins. however, a current flowing in the a/d converter, d/a converter, and on-chip pull-up resistor are not included. 6. when the main system clock operation is halted parameter symbol test conditions min. typ. max unit power supply i dd1 5.0 mhz crystal oscillation v dd = 5.0 v 10 % note 1 412ma current note 5 operating mode v dd = 3.0 v 10 % note 2 0.6 1.8 ma (f xx = 2.5 mhz) note 3 v dd = 2.2 v 10 % note 2 0.35 1.05 ma 5.0 mhz crystal oscillation v dd = 5.0 v 10 % note 1 6.5 19.5 ma operating mode (f xx = 5.0 mhz) note 4 v dd = 3.0 v 10 % note 2 0.8 2.4 ma i dd2 5.0 mhz crystal oscillation v dd = 5.0 v 10 % 1.4 4.2 ma halt mode v dd = 3.0 v 10 % 0.5 1.5 ma (f xx = 2.5 mhz) note 3 v dd = 2.2 v 10 % 280 840 m a 5.0 mhz crystal oscillation v dd = 5.0 v 10 % 1.6 4.8 ma halt mode (f xx = 5.0 mhz) note 4 v dd = 3.0 v 10 % 0.65 1.95 ma i dd3 32.768 khz crystal oscillation v dd = 5.0 v 10 % 60 120 m a operating mode note 6 v dd = 3.0 v 10 % 32 64 m a v dd = 2.2 v 10 % 24 48 m a i dd4 32.768 khz crystal oscillation v dd = 5.0 v 10 % 25 55 m a halt mode note 6 v dd = 3.0 v 10 % 5 15 m a v dd = 2.2 v 10 % 2.5 12.5 m a i dd5 xt1 = v dd v dd = 5.0 v 10 % 1 30 m a stop mode v dd = 3.0 v 10 % 0.5 10 m a when feedback resistor is used v dd = 2.2 v 10 % 0.3 10 m a i dd6 xt1 = v dd v dd = 5.0 v 10 % 0.1 30 m a stop mode v dd = 3.0 v 10 % 0.05 10 m a when feedback resistor is unused v dd = 2.2 v 10 % 0.05 10 m a
46 m pd78052, 78053, 78054, 78055, 78056, 78058 ac characteristics (1) basic operation (t a = e40 to +85 c, v dd = 2.0 to 6.0 v) parameter symbol test conditions min. typ. max. unit cycle time t cy operating on main system clock v dd = 2.7 to 6.0 v 0.8 64 m s (min. instruction (f xx = 2.5 mhz) note 1 2.2 64 m s execution time) operating on main system clock 4.5 v v dd 6.0 v 0.4 32 m s (f xx = 5.0 mhz) note 2 2.7 v v dd < 4.5 v 0.8 32 m s operating on sub system clock 40 note 3 122 125 m s ti00, ti01, ti1, ti2 f ti v dd = 4.5 to 6.0 v 0 4 mhz input frequency 0 275 khz ti00 input high/ t tih , t til 8/f sam note 4 m s low level width ti01, ti1, ti2 t tih , t til v dd = 4.5 to 6.0 v 100 ns input high/ low-level width 1.8 m s interrupt request t inth , t intl intp0 8/f sam note 4 m s input high/low intp1 to intp6, kr0 to kr7 v dd = 2.7 to 6.0 v 10 m s -level width 20 m s reset low t rsl v dd = 2.7 to 6.0 v 10 m s level width 20 m s notes 1. main system clock f xx = f x /2 operation (when an oscillation mode selection register (osms) is set to 00h) 2. main system clock f xx = f x operation (when osms is set to 01h) 3. on an external clock. when a crystal oscillation is used, the minimum value is 114 m s. 4. in combination with bits 0 (scs0) and 1 (scs1) of sampling clock select register (scs), selection of f sam is possible between f xx /2 n , f xx /32, f xx /64 and f xx /128 (when n= 0 to 4).
47 m pd78052, 78053, 78054, 78055, 78056, 78058 t cy vs v dd (at f xx = f x main system clock operation) t cy vs v dd (at f xx = f x /2 main system clock operation) cycle time t cy [ m s] cycle time t cy [ m s] 60 10 2.0 1.0 0.5 0.4 0 1234 56 supply voltage v dd [v] operation guaranteed range 60 10 2.0 1.0 0.5 0.4 0 1234 56 supply voltage v dd [v] operation guaranteed range
48 m pd78052, 78053, 78054, 78055, 78056, 78058 (2) read/write operation (a) when mcs = 1, pcc2 to pcc0 = 000b (t a = e40 to +85 c, v dd = 4.5 to 6.0 v) parameter symbol test conditions min. max. unit astb high-level width t asth 0.85t cy C 50 ns address setup time t ads 0.85t cy C 50 ns address hold time t adh 50 ns data input time from address t add1 (2.85 + 2n)t cy C 80 ns t add2 (4 + 2n)t cy C 100 ns data input time from rd t rdd1 (2 + 2n)t cy C 100 ns t rdd2 (2.85 + 2n)t cy C 100 ns read data hold time t rdh 0ns rd low-level width t rdl1 (2 + 2n)t cy C 60 ns t rdl2 (2.85 + 2n)t cy C 60 ns wait input time from rd t rdwt1 0.85t cy C 50 ns t rdwt2 2t cy C 60 ns wait input time from wr t wrwt 2t cy C 60 ns wait low-level width t wtl (1.15 + 2n)t cy (2 + 2n)t cy ns write data setup time t wds (2.85 + 2n)t cy C 100 ns write data hold time t wdh 20 ns wr low-level width t wrl (2.85 + 2n)t cy C 60 ns rd delay time from astb t astrd 25 ns wr delay time from astb t astwr 0.85t cy + 20 ns astb - delay time from t rdast 0.85t cy C 10 1.15t cy + 20 ns rd - in external fetch address hold time from t rdadh 0.85t cy C 50 1.15t cy + 50 ns rd - in external fetch write data output time from rd - t rdwd 40 ns write data output time from wr t wrwd 050ns address hold time from wr - 0.85t cy 1.15t cy + 40 ns rd - delay time from wait - t wtrd 1.15t cy + 40 3.15t cy + 40 ns wr - delay time from wait - t wtwr 1.15t cy + 30 3.15t cy + 30 ns t wradh remarks 1. mcs: oscillation mode selection register (osms) bit 0 2. pcc2 to pcc0: processor clock control register (pcc) bits 2 to 0 3. t cy = t cy /4 4. n indicates number of waits.
49 m pd78052, 78053, 78054, 78055, 78056, 78058 (b) when except mcs = 1, pcc2 to pcc0 = 000b (t a = C40 to +85 c, v dd = 2.0 to 6.0 v) parameter symbol test conditions min. max. unit astb high-level width t asth v dd = 2.7 to 6.0 v t cy C 80 ns t cy C 150 ns address setup time t ads v dd = 2.7 to 6.0 v t cy C 80 ns t cy C 150 ns address hold time t adh v dd = 2.7 to 6.0 v 0.4t cy C 10 ns 0.37t cy C 40 ns data input time from address t add1 v dd = 2.7 to 6.0 v (3 + 2n)t cy C 160 ns (3 + 2n)t cy C 320 ns t add2 v dd = 2.7 to 6.0 v (4 + 2n)t cy C 200 ns (4 + 2n)t cy C 300 ns data input time from rd t rdd1 v dd = 2.7 to 6.0 v (1.4 + 2n)t cy C 70 ns (1.37 + 2n)t cy C 120 ns t rdd2 v dd = 2.7 to 6.0 v (2.4 + 2n)t cy C 70 ns (2.37 + 2n)t cy C 120 ns read data hold time t rdh 0ns rd low-level width t rdl1 v dd = 2.7 to 6.0 v (1.4 + 2n)t cy C 20 ns (1.37 + 2n)t cy C 20 ns t rdl2 v dd = 2.7 to 6.0 v (2.4 + 2n)t cy C 20 ns (2.37 + 2n)t cy C 20 ns wait input time from rd t rdwt1 v dd = 2.7 to 6.0 v t cy C 100 ns t cy C 200 ns t rdwt2 v dd = 2.7 to 6.0 v 2t cy C 100 ns 2t cy C 200 ns wait input time from wr t wrwt v dd = 2.7 to 6.0 v 2t cy C 100 ns 2t cy C 200 ns wait low-level width t wtl (1 + 2n)t cy (2 + 2n)t cy ns write data setup time t wds v dd = 2.7 to 6.0 v (2.4 + 2n)t cy C 60 ns (2.37 + 2n)t cy C 100 ns write data hold time t wdh 20 ns wr low-level width t wrl v dd = 2.7 to 6.0 v (2.4 + 2n)t cy C 20 ns (2.37 + 2n)t cy C 20 ns rd delay time from astb t astrd v dd = 2.7 to 6.0 v 0.4t cy C 30 ns 0.37t cy C 50 ns wr delay time from astb t astwr v dd = 2.7 to 6.0 v 1.4t cy C 30 ns 1.37t cy C 50 ns remarks 1. mcs: oscillation mode selection register (osms) bit 0 2. pcc2 to pcc0: processor clock control register (pcc) bits 2 to 0 3. t cy = t cy /4 4. n indicates number of waits.
50 m pd78052, 78053, 78054, 78055, 78056, 78058 (b) when except mcs = 1, pcc2 to pcc0 = 000b (t a = C40 to +85 c, v dd = 2.0 to 6.0 v) parameter symbol test conditions min. max. unit astb - delay time from t rdast t cy C 10 t cy + 20 ns rd - in external fetch address hold time from t rdadh t cy C 50 t cy + 50 ns rd - in external fetch write data output time from rd - t rdwd v dd = 2.7 to 6.0 v 0.4t cy C 20 ns 0.37t cy C 40 ns write data output time from wr t wrwd v dd = 2.7 to 6.0 v 0 60 ns 0 120 ns address hold time from wr - t wradh v dd = 2.7 to 6.0 v t cy t cy + 60 ns t cy t cy + 120 ns rd - delay time from wait - t wtrd v dd = 2.7 to 6.0 v 0.6t cy + 180 2.6t cy + 180 ns 0.63t cy + 350 2.63t cy + 350 ns wr - delay time from wait - t wtwr v dd = 2.7 to 6.0 v 0.6t cy + 120 2.6t cy + 120 ns 0.63t cy + 240 2.63t cy + 240 ns remarks 1. mcs: oscillation mode selection register (osms) bit 0 2. pcc2 to pcc0: processor clock control register (pcc) bits 2 to 0 3. t cy = t cy /4 4. n indicates number of waits.
51 m pd78052, 78053, 78054, 78055, 78056, 78058 (3) serial interface (t a = e40 to +85 c, v dd = 2.0 to 6.0 v) (a) serial interface channel 0 (i) 3-wire serial i/o mode (sck0... internal clock output) parameter symbol test conditions min. typ. max. unit 4.5 v v dd 6.0 v 800 ns 2.7 v v dd < 4.5 v 1600 ns 3200 ns t kh1 , t kl1 v dd = 4.5 to 6.0 v t kcy1 /2 C 50 ns t kcy1 /2 C 100 ns t sik1 4.5 v v dd 6.0 v 100 ns 2.7 v v dd < 4.5 v 150 ns 300 ns t ksi1 400 ns 300 ns sck0 cycle time sck0 high/low-level width si0 setup time (to sck0 - ) si0 hold time (from sck0 - ) t kso1 c = 100 pf note so0 output delay time from sck0 note c is the load capacitance of so0 output line. parameter symbol test conditions min. typ. max. unit 4.5 v v dd 6.0 v 800 ns 2.7 v v dd < 4.5 v 1600 ns 3200 ns t kh2 , t kl2 4.5 v v dd 6.0 v 400 ns 2.7 v v dd < 4.5 v 800 ns 1600 ns t sik2 100 ns t ksi2 400 ns 300 ns sck0 rise, fall time t r2 , t f2 when using external device 160 ns expansion function when not using external device 1000 ns expansion function sck0 cycle time sck0 high/low-level width si0 setup time (to sck0 - ) si0 hold time (from sck0 - ) so0 output delay time from sck0 (ii) 3-wire serial i/o mode (sck0... external clock input) c = 100 pf note t kso2 t kcy1 t kcy2 note c is the load capacitance of so0 output line.
52 m pd78052, 78053, 78054, 78055, 78056, 78058 (iii) sbi mode (sck0... internal clock output) parameter symbol test conditions min. typ. max. unit sck0 cycle time t kcy3 v dd = 4.5 to 6.0 v 800 ns 3200 ns sck0 high/low-level width t kh3 , t kl3 v dd = 4.5 to 6.0 v t kcy3 /2 C 50 ns t kcy3 /2 C 150 ns sb0, sb1 setup time t sik3 v dd = 4.5 to 6.0 v 100 ns (to sck0 - ) 300 ns sb0, sb1 hold time t ksi3 t kcy3 /2 ns (from sck0 - ) sb0, sb1 output delay t kso3 r = 1 k w , v dd = 4.5 to 6.0 v 0 250 ns time from sck0 c = 100 pf note 0 1000 ns sb0, sb1 from sck0 - t ksb t kcy3 ns sck0 from sb0, sb1 t sbk t kcy3 ns sb0, sb1 high-level width t sbh t kcy3 ns sb0, sb1 low-level width t sbl t kcy3 ns note r and c are the load resistors and load capacitance of the sck0, sb0 and sb1 output line. (iv) sbi mode (sck0... external clock input) parameter symbol test conditions min. typ. max. unit sck0 cycle time t kcy4 v dd = 4.5 to 6.0 v 800 ns 3200 ns sck0 high/low-level width t kh4 , t kl4 v dd = 4.5 to 6.0 v 400 ns 1600 ns sb0, sb1 setup time t sik4 v dd = 4.5 to 6.0 v 100 ns (to sck0 - ) 300 ns sb0, sb1 hold time t ksi4 t kcy4 /2 ns (from sck0 - ) sb0, sb1 output delay t kso4 r = 1 k w ,v dd = 4.5 to 6.0 v 0 300 ns time from sck0 c = 100 pf note 0 1000 ns sb0, sb1 from sck0 - t ksb t kcy4 ns sck0 from sb0, sb1 t sbk t kcy4 ns sb0, sb1 high-level width t sbh t kcy4 ns sb0, sb1 low-level width t sbl t kcy4 ns sck0 rise, fall time t r4 , t f4 when using external device 160 ns expansion fanction when not using external device 1000 ns expansion function note r and c are the load resistors and load capacitance of the sb0 and sb1 output line.
53 m pd78052, 78053, 78054, 78055, 78056, 78058 parameter symbol test conditions min. typ. max. unit sck0 cycle time t kcy5 r = 1 k w ,v dd = 2.7 to 6.0 v 1600 ns c = 100 pf note 3200 ns sck0 high-level width t kh5 v dd = 2.7 to 6.0 v t kcy5 /2 C 160 ns t kcy5 /2 C 190 ns sck0 low-level width t kl5 v dd = 4.5 to 6.0 v t kcy5 /2 C 50 ns t kcy5 /2 C 100 ns sb0, sb1 setup time t sik5 4.5 v v dd 6.0 v 300 ns (to sck0 - ) 2.7 v v dd < 4.5 v 350 ns 400 ns sb0, sb1 hold time t ksi5 600 ns (from sck0 - ) sb0, sb1 output delay t kso5 0 300 ns time from sck0 (vi) 2-wire serial i/o mode (sck0... internal clock input) parameter symbol test conditions min. typ. max. unit sck0 cycle time t kcy6 v dd = 2.7 to 6.0 v 1600 ns 3200 ns sck0 high-level width t kh6 v dd = 2.7 to 6.0 v 650 ns 1300 ns sck0 low-level width t kl6 v dd = 2.7 to 6.0 v 800 ns 1600 ns sb0, sb1 setup time t sik6 100 ns (to sck0 - ) sb0, sb1 hold time t ksi6 t kcy6 /2 ns (from sck0 - ) sb0, sb1 output delay t kso6 r = 1 k w ,v dd = 4.5 to 6.0 v 0 300 ns time from sck0 c = 100 pf note 0 500 ns sck0 rise, fall time t r6 , t f6 when using external device 160 ns expansion function when not using external device 1000 ns expansion function (v) 2-wire serial i/o mode (sck0... internal clock output) note r and c are the load resistors and load capacitance of the sck0, sb0 and sb1 output line. note r and c are the load resistors and load capacitance of the sck0, sb0 and sb1 output line.
54 m pd78052, 78053, 78054, 78055, 78056, 78058 (b) serial interface channel 1 (i) 3-wire serial i/o mode (sck1...internal clock output) parameter symbol test conditions min. typ. max. unit sck1 cycle time t kcy7 4.5 v v dd 6.0 v 800 ns 2.7 v v dd < 4.5 v 1600 ns 3200 ns sck1 high/low-level width t kh7 ,v dd = 4.5 to 6.0 v t kcy7 /2 C 50 ns t kl7 t kcy7 /2 C 100 ns si1 setup time (to sck1 - )t sik7 4.5 v v dd 6.0 v 100 ns 2.7 v v dd < 4.5 v 150 ns 300 ns si1 hold time (from sck1 - )t ksi7 400 ns so1 output delay time from sck1 t kso7 c = 100 pf note 300 ns (ii) 3-wire serial i/o mode (sck1...external clock input) note c is the load capacitance of the so1 output line. parameter symbol test conditions min. typ. max. unit sck1 cycle time t kcy8 4.5 v v dd 6.0 v 800 ns 2.7 v v dd < 4.5 v 1600 ns 3200 ns sck1 high/low-level width t kh8 , 4.5 v v dd 6.0 v 400 ns t kl8 2.7 v v dd < 4.5 v 800 ns 1600 ns si1 setup time (to sck1 - )t sik8 100 ns si1 hold time (from sck1 - )t kis8 400 ns so1 output delay time from sck1 t kso8 c = 100 pf note 300 ns sck1 rise, fall time t r8 , t f8 when using external device 160 ns expansion function when not using external device 1000 ns expansion function note c is the load capacitance of the so output line.
55 m pd78052, 78053, 78054, 78055, 78056, 78058 (iii) 3-wire serial i/o mode with automatic transmit/receive function (sck1...internal clock output) parameter symbol test conditions min. typ. max. unit sck1 cycle time t kcy9 4.5 v v dd 6.0 v 800 ns 2.7 v v dd < 4.5 v 1600 ns 3200 ns sck1 high/low-level width t kh9 ,v dd = 4.5 to 6.0 v t kcy9 /2 C 50 ns t kl9 t kcy9 /2 C 100 ns si1 setup time (to sck1 - )t sik9 4.5 v v dd 6.0 v 100 ns 2.7 v v dd < 4.5 v 150 ns 300 ns si1 hold time (from sck1 - )t ksi9 400 ns so1 output delay time from sck1 t kso9 c = 100 pf note 300 ns stb - from sck1 - t sbd t kcy9 /2 C 100 t kcy9 /2 + 100 ns strobe signal high-level width t sbw v dd = 2.7 to 6.0v t kcy9 C 30 t kcy9 + 30 ns t kcy9 C 60 t kcy9 + 60 ns busy signal setup time t bys 100 ns (to busy signal detection timing) busy signal hold time t byh 4.5 v v dd 6.0 v 100 ns (from busy signal detection timing) 2.7 v v dd < 4.5 v 150 ns 200 ns sck1 from busy inactive t sps 2t kcy9 ns (iv) 3-wire serial i/o mode with automatic transmit/receive function (sck1...external clock input) note c is the load capacitance of the so1 output line. parameter symbol test conditions min. typ. max. unit sck1 cycle time t kcy10 4.5 v v dd 6.0 v 800 ns 2.7 v v dd < 4.5 v 1600 ns 3200 ns sck1 high/low-level width t kh10 , 4.5 v v dd 6.0 v 400 ns t kl10 2.7 v v dd < 4.5 v 800 ns 1600 ns si1 setup time (to sck1 - )t sik10 100 ns si1 hold time (from sck1 - )t kis10 400 ns so1 output delay time from sck1 t kso10 c = 100 pf note 300 ns sck1 rise, fall time t r10 , t f10 when using external device 160 ns expansion function when not using external device 1000 ns expansion function note c is the load capacitance of the so1 output line.
56 m pd78052, 78053, 78054, 78055, 78056, 78058 (c) serial interface channel 2 (i) 3-wire serial i/o mode (sck2...internal clock output) parameter symbol test conditions min. typ. max. unit sck2 cycle time t kcy11 4.5 v v dd 6.0 v 800 ns 2.7 v v dd < 4.5 v 1600 ns 3200 ns sck2 high/low-level width t kh11 ,v dd = 4.5 to 6.0 v t kcy7 /2 C 50 ns t kl11 t kcy7 /2 C 100 ns si2 setup time (to sck2 - )t sik11 4.5 v v dd 6.0 v 100 ns 2.7 v v dd < 4.5 v 150 ns 300 ns si2 hold time (from sck2 - )t ksi11 400 ns so2 output delay time from sck2 t kso11 c = 100 pf note 300 ns note c is the load capacitance of the so2 output line. parameter symbol test conditions min. typ. max. unit asck cycle time t kcy12 4.5 v v dd 6.0 v 800 ns 2.7 v v dd < 4.5 v 1600 ns 3200 ns asck high-/low-level width t kh12 , 4.5 v v dd 6.0 v 400 ns t kl12 2.7 v v dd < 4.5 v 800 ns 1600 ns transfer rate 4.5 v v dd 6.0 v 39063 bps 2.7 v v dd < 4.5 v 19531 bps 9766 bps asck rise, fall time t r12 ,v dd = 4.5 to 6.0 v, 1000 ns t f12 when not using external device expansion function. 160 ns (ii) uart mode (dedicated baud rate generator output) parameter symbol test conditions min. typ. max. unit transfer rate 4.5 v v dd 6.0 v 78125 bps 2.7 v v dd < 4.5 v 39063 bps 19531 bps (iii) uart mode (external clock input)
57 m pd78052, 78053, 78054, 78055, 78056, 78058 ac timing test point (excluding x1, xt1 input) clock timing ti timing 0.8 v dd 0.2 v dd 0.8 v dd 0.2 v dd test points t xl t xh 1/f x v ih4 (min.) v il4 (max.) t xtl t xth 1/f xt v ih5 (min.) v il5 (max.) x1 input xt1 input 1/f ti t tih t til ti00, ti01, ti0, ti2
58 m pd78052, 78053, 78054, 78055, 78056, 78058 read/write operation external fetch (no wait) : t asth t adh t add1 hi-z t ads t rdd1 t rdadh t rdast t astrd t rdl1 t rdh a8 to a15 ad0 to ad7 astb rd upper 8-bit address operation code lower 8-bit address t asth t adh t add1 hi-z t ads t rdadh t rdast t astrd t rdl1 t rdh a8 to a15 ad0 to ad7 astb rd t wtrd t wtl t rdwt1 wait t rdd1 upper 8-bit address operation code lower 8-bit address external fetch (wait insertion) :
59 m pd78052, 78053, 78054, 78055, 78056, 78058 external data access (no wait) : external data access (wait insertion) : t astrd t asth t adh t add2 hi-z t ads t rdl2 a8 to a15 ad0 to ad7 astb rd t wds t wrl wr t rdh hi-z hi-z t wrwd t astwr t wradh upper 8-bit address write data read data lower 8-bit address t rdd2 t wdh t rdwd t astrd t asth t adh t add2 hi-z t ads t rdl2 a8 to a15 ad0 to ad7 astb rd t wds t wrl wr t rdh hi-z hi-z t wdwr t astwr t wradh upper 8-bit address write data read data lower 8-bit address t rdd2 t wdh t rdwt2 t wtl t wrwt t wtwr t wtl wait t wtrd t rdwd
60 m pd78052, 78053, 78054, 78055, 78056, 78058 serial transfer timing 3-wire serial i/o mode : sbi mode (command signal transfer) : sbi mode (bus release signal transfer) : t sik3, 4 t kcy3, 4 t kl3, 4 t kh3, 4 sck0 t sbl t sbh t ksb t sbk t ksi3, 4 t kso3, 4 sb0, sb1 t r4 t f4 t sik3, 4 t kcy3,4 t kl3, 4 t kh3, 4 sck0 t ksb t sbk t ksi3, 4 t kso3, 4 sb0, sb1 t r4 t f4 t kcym t klm t khm sck0 to sck2 si0 to si2 so0 to so2 m = 1, 2, 7, 8, 11 n = 2, 8 t sikm t ksim t ksom input data output data t rn t fn
61 m pd78052, 78053, 78054, 78055, 78056, 78058 2-wire serial i/o mode : 3-wire serial i/o mode with automatic transmit/receive function : 3-wire serial i/o mode with automatic transmit/receive function (busy processing) : note the signal is not actually driven low here; it is shown as such to indicate the timing. t kso5, 6 t sik5, 6 t kcy5, 6 t kl5, 6 t kh5, 6 sck0 t ksi5, 6 sb0, sb1 t f6 t r6 t sbw t sbd t kcy9, 10 t kh9, 10 t ksi9, 10 t kso9, 10 t sik9, 10 d2 d1 d0 d7 d7 d2 d1 d0 so1 si1 sck1 stb t r10 t kl9, 10 t f10 t bys sck1 t sps busy (active high) 789 note 10 note 10+n note 1 t byh
62 m pd78052, 78053, 78054, 78055, 78056, 78058 uart mode (external clock input) : a/d converter characteristics (t a = e40 to +85 c, av dd = v dd = 2.0 to 6.0 v, av ss = v ss = 0 v) parameter symbol test conditions min. typ. max. unit resolution 8 8 8 bit overall error note 2.7 v av ref0 av dd 0.6 % 2.0 v av ref0 < 2.7 v 1.4 % conversion time t conv 19.1 200 m s sampling time t samp 12/fxx m s analog input voltage v ian av ss av ref0 v reference voltage av ref0 2.0 av dd v resistance between av ref0 and av ss r airef0 4 14 k w parameter symbol test conditions min. typ. max. unit resolution 8 bit overall error r = 2m w note 1 1.2 % r = 4m w note 1 0.8 % r = 10m w note 1 0.6 % settling time note 1 4.5 v av ref1 6.0 v 10 m s c=30pf 2.7 v av ref1 < 4.5 v 15 m s 2.0 v av ref1 < 2.7 v 20 m s output resistance r o dacs0, dacs1 = 55h note 2 10 k w analog reference voltage av ref1 2.0 v dd v av ref1 current i ref1 note 2 1.5 ma note overroll error excluding quantization error ( 1/2 lsb). it is indicated as a ratio to the full-scale value. remark f xx : main system clock frequency (f x or f x /2) f x : main system clock oscillation frequency d/a converter characteristics (t a = C40 to +85 c, v dd = 2.0 to 6.0 v, av ss = v ss = 0 v) t kcy12 t kh12 t kl12 t f12 t r12 asck notes 1. r and c denote d/a converter output pin load resistance and load capacitance, respectively. 2. value for 1 d/a converter channel remark dacs0 and dacs1: d/a conversion value setting register 0 and 1
63 m pd78052, 78053, 78054, 78055, 78056, 78058 data memory stop mode low supply voltage data retention characteristics (t a = e40 to +85 c) note in combination with bits 0 to 2 (osts0 to osts2) of oscillation stabilization time select register (osts) , selection of 2 12 /f xx and 2 14 /f xx to 2 17 /f xx is possible. remark f xx : main system clock frequency (f x or f x /2) f x : main system clock oscillatior frequency data retention timing (stop mode release by reset) parameter symbol test conditions min. typ. max. unit data retention power v dddr 1.8 6.0 v supply voltage data retention i dddr v dddr = 1.8 v 0.1 10 m a power supply subsystem clock stop and feed-back resistor current disconnected release signal set time t srel 0 m s oscillation stabiliation t wait release by reset 2 17 /fx ms wait time release by interrupt request note ms data retention timing (standby release signal: stop mode release by interrupt request signal) t srel t wait v dd reset stop instruction execution stop mode data retension mode internal reset operation halt mode operating mode v dddr t srel t wait v dd stop instruction execution stop mode data retension mode halt mode operating mode standby release signal (interrupt request) v dddr
64 m pd78052, 78053, 78054, 78055, 78056, 78058 interrupt request input timing t intl t inth intp0 to intp6 t rsl reset reset input timing
65 m pd78052, 78053, 78054, 78055, 78056, 78058 12. characteristic curves (reference value) i dd vs v dd (fx = fxx = 5.0 mhz) (t a = 25 c) pcc = 01h pcc = 00h pcc = 02h pcc = 03h pcc = 04h pcc = 30h halt (x1 osillation, xt1 osillation) pcc = b0h halt (x1 stop, xt1 osillation) 0 23456789 0.001 0.005 0.01 0.05 0.1 1.0 5.0 10.0 supply voltage v dd (v) supply current i dd (ma) 0.5
66 m pd78052, 78053, 78054, 78055, 78056, 78058 i dd vs v dd (fx = 5.0 mhz, fxx = 2.5 mhz) (t a = 25 c) pcc = 00h pcc = 01h pcc = 02h pcc = 03h pcc = 30h halt (x1 osillation, xt1 osillation) pcc = b0h halt (x1 stop, xt1 osillation) 0 23456789 0.001 0.005 0.01 0.05 0.1 1.0 5.0 10.0 supply voltage v dd (v) supply current i dd (ma) pcc = 04h 0.5
67 m pd78052, 78053, 78054, 78055, 78056, 78058 13. package drawings remark dimensions and materials of es product are the same as those of mass-production products. 80 pin plastic qfp (14 14) item millimeters inches note each lead centerline is located within 0.13 mm (0.005 inch) of its true position (t.p.) at maximum material condition. p80gc-65-8bt f 0.825 0.032 b 14.00?.20 0.551 +0.009 ?.008 s 1.70 max. 0.067 max. m 0.17 0.007 +0.001 ?.003 +0.03 ?.07 +0.009 ?.008 c 14.00?.20 0.551 +0.009 ?.008 a 17.20?.20 0.677?.008 g 0.825 0.032 h 0.32?.06 0.013 +0.002 ?.003 i 0.13 0.005 j 0.65 (t.p.) 0.026 (t.p.) k 1.60?.20 0.063?.008 l 0.80?.20 0.031 +0.009 ?.008 n 0.10 0.004 p 1.40?.10 0.055?.004 q 0.125?.075 0.005?.003 r3 3 +7 ? +7 ? d 17.20?.20 0.677?.008 41 60 40 61 21 80 20 1 m s q r k m l a b c d j h i f g p n detail of lead end
68 m pd78052, 78053, 78054, 78055, 78056, 78058 remark dimensions and materials of es product are the same as those of mass-production products. 80 pin plastic tqfp (fine pitch) (12 12) item millimeters inches i j 0.5 (t.p.) 0.10 0.004 0.020 (t.p.) a note each lead centerline is located within 0.10 mm (0.004 inch) of its true position (t.p.) at maximum material condition. s a 14.0?.2 0.551 +0.009 ?.008 b 12.0?.2 0.472 +0.009 ?.008 c 12.0?.2 0.472 +0.009 ?.008 d 14.0?.2 0.551 +0.009 ?.008 f g 1.25 1.25 0.049 0.049 h 0.22 0.009?.002 p80gk-50-be9-4 s 1.27 max. 0.050 max. k 1.0?.2 0.039 +0.009 ?.008 l 0.5?.2 0.020 +0.008 ?.009 m 0.145 0.006?.002 n 0.10 0.004 p 1.05 0.041 q 0.05?.05 0.002?.002 r 55 55 +0.05 ?.04 +0.055 ?.045 b c d j h i g f p n l k m q r detail of lead end m 61 60 41 40 21 20 1 80
69 m pd78052, 78053, 78054, 78055, 78056, 78058 soldering recommended method soldering conditions condition symbol infrared reflow ir35-100-2 vps vp15-100-2 wave soldering ws60-100-1 partial heating 14. recommended soldering conditions this product should be soldered and mounted under the conditions recommended in the table below. for detail of recommended soldering conditions, refer to the information document semiconductor device mounting technology manual (c10535e) . for soldering methods and conditions other than those recommended below, contact our sales personnel. table 14-1. surface mounting type soldering conditions (1/2) (1) m pd78052gc- -8bt : 80-pin plastic qfp (14 14 mm) m pd78053gc- -8bt : 80-pin plastic qfp (14 14 mm) m pd78054gc- -8bt : 80-pin plastic qfp (14 14 mm) m pd78055gc- -8bt : 80-pin plastic qfp (14 14 mm) m PD78056gc- -8bt : 80-pin plastic qfp (14 14 mm) m pd78058gc- -8bt : 80-pin plastic qfp (14 14 mm) package peak temperature: 235 c, duration: 30 sec. max. (at 210 c or above), number of times: twice max. package peak temperature: 215 c, duration: 40 sec. max. (at 200 c or above), number of times: twice max. solder bath temperature: 260 c or less, duration: 10 sec. max. number of times: once preparatory heating temepratuire: 120 c max. (package surface temperature) time limit: 7 days note (thereafter 10 hours 125 c prebaking required) pin temperature: 300 c max. duration: 3 sec. max. (per device side) caution use of more than one soldering method should be avoided (except in the case of partial heating).
70 m pd78052, 78053, 78054, 78055, 78056, 78058 soldering recommended method soldering conditions condition symbol infrared reflow ir35-107-3 vps vp15-107-3 partial heating table 14-1. surface mounting type soldering conditions (2/2) (2) m pd78052gk- -be9 : 80-pin plastic tqfp (12 12 mm) m pd78053gk- -be9 : 80-pin plastic tqfp (12 12 mm) m pd78054gk- -be9 : 80-pin plastic tqfp (12 12 mm) m pd78055gk- -be9 : 80-pin plastic tqfp (12 12 mm) m PD78056gk- -be9 : 80-pin plastic tqfp (12 12 mm) m pd78058gk- -be9 : 80-pin plastic tqfp (12 12 mm) package peak temperature: 235 c, duration: 30 sec. max. (at 210 c or above), number of times: thrice max., time limit: 7 days note (thereafter 10 hours 125 c prebaking required) baking cannot be applied to other than heat-resistant trays (magazine, taping, non- heat-resistant trays) when the product is wrapped. package peak temperature: 215 c, duration: 40 sec. max. (at 200 c or above), number of times: thrice max., time limit: 7 days note (thereafter 10 hours 125 c prebaking required) baking cannot be applied to other than heat-resistant trays (magazine, taping, non- heat-resistant trays) when the product is wrapped. pin temperature: 300 c max. duration: 3 sec. max. (per device side) note for the storage period after dry-pack decompression storage conditions are max. 25 c, 65% rh. caution use of more than one soldering method should be avoided (except in the case of partial heating).
71 m pd78052, 78053, 78054, 78055, 78056, 78058 appendix a. development tools the following tools are available for development of systems using the m pd78054 subseries: language processing software ra78k/0 note 1, 2, 3, 4 assembler package common to 78k/0 series cc78k/0 note 1, 2, 3, 4 c compiler package common to 78k/0 series df78054 note 1, 2, 3, 4 device file for m pd78054 subseries cc78k/0-l note 1, 2, 3, 4 c compiler library source file common to 78k/0 series prom writing tools pg-1500 prom programmer pa-78p054gc programmer adapter connectd to pg-1500 pa-78p054gk pa-78p054kk-t pg-1500 controller note 1, 2 control program for pg-1500 debugging tools ie-78000-r in-circuit emulator common to 78k/0 series ie-78000-r-a in-circuit emulator common to 78k/0 series (for integrated debugger) ie-78000-r-bk break board common to 78k/0 series ie-780308-r-em emulation board for evaluating m pd780308 subseries ie-78000-r-sv3 interface adapter and cable when using ews for the host machine (for ie-78000-r-a) ie-78000-98-if-b interface adapter when using the pc-9800 series (except for notebook computers) for the host machine (for ie-78000-r-a) ie-78000-98n-if interface adapter and cable when using the pc-9800 series notebook computers for the host machine (for ie-78000-r-a) ie-78000-98-if-b interface adapter when using ibm/pc at? and its compatibles for the host machine (for ie-78000-r-a) ep-78230gc-r emulation probe common to m pd78234 subseries ep-78054gk-r emulation probe for m pd78054 subseries ev-9200gc-80 socket mounted to target system created for 80-pin plastic qfp (gc-8bt type) tgk-080sbw adapter mounted to target system created for 80-pin plastic tqfp (gk-be9 type). this is a product from tokyo eletech corporation (tel (03) 5295-1661) when purchasing this product, please consult with nec sales offices. sm78k0 note 5, 6, 7 system simulator common to 78k/0 series id78k0 note 4, 5, 6, 7 integrated debugger for ie-78000-r-a sd78k/0 note 1, 2 screen debugger for ie-78000-r df78054 note 1, 2, 4, 5, 6, 7 device file for m pd78054 subseries real-time os rx78k/0 note 1, 2, 3, 4 real-time os for 78k/0 series mx78k0 note 1, 2, 3, 4 os for 78k/0 series
72 m pd78052, 78053, 78054, 78055, 78056, 78058 fuzzy inference development support system fe9000 note 1 /fe9200 note 6 fuzzy knowledge data creation tool ft9080 note 1 /ft9085 note 2 translator fi78k0 note 1, 2 fuzzy inference module fd78k0 note 1, 2 fuzzy inference debugger notes 1. pc-9800 series (ms-dos tm ) based 2. ibm pc/at and its compatibles (pc dos tm /ibm dos tm /ms-dos) based 3. hp9000 series 300 tm (hp-ux tm ) based 4. hp9000 series 700 tm (hp-ux) based, sparcstation tm (sun os tm ) based, ews4800 series (ews-ux/v) based 5. pc-9800 series (ms-dos + windows tm ) based 6. ibm pc/at and compatible (pc dos/ibm dos/ms-dos + windows) based 7. news tm (news-os tm ) based remarks 1. please refer to the 78k/0 series selection guide (u11126e) for information on third party develop- ment tools. 2. ra78k/0, cc78k/0, sm78k0, id78k0, sd78k/0, and rx78k/0 are used in combination with df78054.
73 m pd78052, 78053, 78054, 78055, 78056, 78058 appendix b. related documents documents related to devices document name document no. english japanese m pd78054 and 78054y subseries users manual u11747e u11747j m pd78052, 78053, 78054, 78055, 78056, 78058 data sheet this document u12327j m pd78p054 data sheet ic-3216 u12346j m pd78p058 data sheet u10417e ic-8884 78k/0 series users manual - instruction u12326e u12326j 78k/0 series instruction set u10904j 78k/0 series instruction list u10903j m pd78054 subseries special function register table u10102j 78k/0 series application note fundamental (iii) u10182e u10182j floating-point operation program volume iea-1289 iea-718 development tool documents (users manual) document name document no. english japanese ra78k series assembler package operation eeu-1399 eeu-809 language eeu-1404 eeu-815 ra78k series structured assembler preprocessor eeu-1402 u12323j ra78k0 assembler package operation u11802e u11802j assembly language u11801e u11801j structured assembly language u11789e u11789j cc78k series c compiler operation eeu-1280 eeu-656 language eeu-1284 eeu-655 cc78k0 c compiler operation u11517e u11517j language u11518e u11518j cc78k/0 c compiler application note programming know-how eea-1208 eea-618 cc78k series library source file u12322j pg-1500 prom programmer u11940e u11940j pg-1500 controller pc-9800 series (ms-dos) based eeu-1291 eeu-704 pg-1500 controller ibm pc series (pc dos) based u10540e eeu-5008 ie-78000-r u11376e u11376j ie-78000-r-a u10057e u10057j ie-78000-r-bk eeu-1427 eeu-867 ie-780308-r-em u11362e u11362j ep-78230 eeu-1515 eeu-985 ep-78054gk-r eeu-1468 eeu-932 caution the documents listed above are subject to change without notice. be sure to use the latest documents for designing your system.
74 m pd78052, 78053, 78054, 78055, 78056, 78058 document name document no. english japanese sm78k0 system simulator windows based reference u10181e u10181j sm78k series system simulator external components u10092e u10092j user-open interface specification id78k0 integrated debugger ews based reference u11151j id78k0 integrated debugger pc based reference u11539e u11539j id78k0 integrated debugger windows based guide u11649e u11649j sd78k/0 screen debugger pc-9800 series (ms-dos) based introduction eeu-852 reference u10952j sd78k/0 screen debugger ibm pc/at (pc dos) based introduction u10539e eeu-5024 reference u11279e u11279j documents related to embedded software (users manual) document name document no. english japanese 78k/0 series real-time os fundamental u11537e u11537j installation u11536e u11536j 78k/0 series os mx78k0 fundamental u12257e u12257j fuzzy knowledge data creation tool eeu-1438 eeu-829 78k/0, 78k/ii, 87ad series fuzzy inference development suppport system - translator eeu-1444 eeu-862 78k/0 series fuzzy inference development support system - fuzzy inference module eeu-1441 eeu-858 78k/0 series fuzzy inference development support system - fuzzy inference debugger eeu-1458 eeu-921 other related documents document name document no. english japanese ic package manual c10943x semiconductor device mounting technology manual c10535e c10535j quality grade on nec semiconductor devices c11531e c11531j nec semiconductor device reliability/quality control system c10983e c10983j guide to prevent damage for semiconductor devices by electrostatic discharge (esd) c11892e c11892j semiconductor device quality guarantee guide mei-1202 c11893j product guide related to microcomputer - other manufacturers u11416j caution the documents listed above are subject to change without notice. be sure to use the latest documents for designing your system.
75 m pd78052, 78053, 78054, 78055, 78056, 78058 [memo]
76 m pd78052, 78053, 78054, 78055, 78056, 78058 notes for cmos devices 1 precaution against esd for semiconductors note: strong electric field, when exposed to a mos device, can cause destruction of the gate oxide and ultimately degrade the device operation. steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. environmental control must be adequate. when it is dry, humidifier should be used. it is recommended to avoid using insulators that easily build static electricity. semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. all test and measurement tools including work bench and floor should be grounded. the operator should be grounded using wrist strap. semiconductor devices must not be touched with bare hands. similar precautions need to be taken for pw boards with semiconductor devices on it. 2 handling of unused input pins for cmos note: no connection for cmos device inputs can be cause of malfunction. if no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. cmos devices behave differently than bipolar or nmos devices. input levels of cmos devices must be fixed high or low by using a pull-up or pull-down circuitry. each unused pin should be connected to v dd or gnd with a resistor, if it is considered to have a possibility of being an output pin. all handling related to the unused pins must be judged device by device and related specifications governing the devices. 3 status before initialization of mos devices note: power-on does not necessarily define initial status of mos device. produc- tion process of mos does not define the initial operation status of the device. immediately after the power source is turned on, the devices with reset function have not yet been initialized. hence, power-on does not guarantee out-pin levels, i/o settings or contents of registers. device is not initialized until the reset signal is received. reset operation must be executed imme- diately after power-on for devices having reset function.
77 m pd78052, 78053, 78054, 78055, 78056, 78058 nec electronics inc. (u.s.) santa clara, california tel: 800-366-9782 fax: 800-729-9288 nec electronics (germany) gmbh duesseldorf, germany tel: 0211-65 03 02 fax: 0211-65 03 490 nec electronics (uk) ltd. milton keynes, uk tel: 01908-691-133 fax: 01908-670-290 nec electronics italiana s.r.1. milano, italy tel: 02-66 75 41 fax: 02-66 75 42 99 nec electronics hong kong ltd. hong kong tel: 2886-9318 fax: 2886-9022/9044 nec electronics hong kong ltd. seoul branch seoul, korea tel: 02-528-0303 fax: 02-528-4411 nec electronics singapore pte. ltd. united square, singapore 1130 tel: 253-8311 fax: 250-3583 nec electronics taiwan ltd. taipei, taiwan tel: 02-719-2377 fax: 02-719-5951 nec do brasil s.a. sao paulo-sp, brasil tel: 011-889-1680 fax: 011-889-1689 nec electronics (germany) gmbh benelux office eindhoven, the netherlands tel: 040-2445845 fax: 040-2444580 nec electronics (france) s.a. velizy-villacoublay, france tel: 01-30-67 58 00 fax: 01-30-67 58 99 nec electronics (france) s.a. spain office madrid, spain tel: 01-504-2787 fax: 01-504-2860 nec electronics (germany) gmbh scandinavia office taeby, sweden tel: 08-63 80 820 fax: 08-63 80 388 regional information some information contained in this document may vary from country to country. before using any nec product in your application, please contact the nec office in your country to obtain a list of authorized representatives and distributors. they will verify: ? device availability ? ordering information ? product release schedule ? availability of related technical literature ? development environment specifications (for example, specifications for third-party tools and components, host computers, power plugs, ac supply voltages, and so forth) ? network requirements in addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary from country to country. j96. 8
fip is a trademark of nec corporation. iebus is a trademark of nec corporation. ms-dos and windows are either registered trademarks or trademarks of microsoft corporation in the united states and/or other countries. ibm dos, pc/at, and pc dos are trademarks of international business machines corporation. hp9000 series 300, hp9000 series 700, and hp-ux are trademarks of hewlett-packard company. sparcstation is a trademark of sparc international, inc. sunos is a trademark of sun microsystems, inc. news and news-os are trademarks of sony corporation. no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec corporation. nec corporation assumes no responsibility for any errors which may appear in this document. nec corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. no license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec corporation or others. while nec corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. to minimize risks of damage or injury to persons or property arising from a defect in an nec semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. nec devices are classified into the following three quality grades: "standard", "special", and "specific". the specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. the recommended applications of a device depend on its quality grade, as indicated below. customers must check the quality grade of each device before using it in a particular application. standard: computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots special: transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) specific: aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. the quality grade of nec devices is "standard" unless otherwise specified in nec's data sheets or data books. if customers intend to use nec devices for applications other than those specified for standard quality grade, they should contact an nec sales representative in advance. anti-radioactive design is not implemented in this product. m4 96.5 the export of this product from japan is regulated by the japanese government. to export this product may be prohibited without governmental license, the need for which must be judged by the customer. the export or re-export of this product from a country other than japan may also be prohibited without a license from that country. please call an nec sales representative. m pd78052, 78053, 78054,78055,78056, 78058


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